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Crimping method of welding-free high-airtight connector

A technology of high-density connectors and connectors, which is applied in the assembly/disassembly of contacts, etc., and can solve problems such as deformation, increased time cost, and high density

Active Publication Date: 2017-05-31
武汉数字工程研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the aperture on the printed circuit board to be crimped is too small, the number of pins of the connector is too large, and the density is too high. When crimping, the lower die is slightly deviated from the printed circuit board. One or Multiple pins will be deformed, causing damage to the connector and the printed circuit board. At the same time, the alignment of the lower die and the printed circuit board also adds time and cost to the crimping process.

Method used

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  • Crimping method of welding-free high-airtight connector
  • Crimping method of welding-free high-airtight connector
  • Crimping method of welding-free high-airtight connector

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Embodiment Construction

[0025] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention and are not intended to limit this invention.

[0026] Such as Figure 1-4 As shown, a crimping method of a solderless high-density connector is implemented based on a tooling fixture including a cavity 6, a lower die 5 and an upper die 2, and is characterized in that the crimping method includes Follow the steps below:

[0027] Step 1) design and manufacture of a tooling fixture, the tooling fixture includes a container 6, a lower die 5 and an upper die 2,

[0028] Step 1) Place the tank 6 in step 1) horizontally on the platform of the crimping machine 1, put the lower die 5 in step 1) into the inner cavity of the tank 6, and then place the ...

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PUM

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Abstract

The invention discloses a crimping method of a welding-free high-airtight connector. The crimping method is characterized in the design of tooling clamps; each tooling clamp comprises a containing groove (6), a lower press die (5) and an upper press die (2); the tooling clamps are applied to the crimping of the connector to form the crimping method of the welding-free high-airtight connector. The crimping method has the advantages that the welding-free high-airtight connector can be quickly and accurately crimped; a plurality of welding-free high-airtight connectors can be crimped by one crimping process.

Description

technical field [0001] The invention relates to the technical field of circuit board assembly technology, in particular to a crimping method for a solder-free high-density connector. Background technique [0002] At present, the connection between the solderless high-density connector and the printed circuit board is to crimp the pins of the connector into the holes of the printed circuit board by a press, forming an interference fit to make them tightly connected together, eliminating the need for previous The process of soldering after crimping saves labor and raw materials, improves efficiency, and also reduces the impact of high temperature on the printed circuit board during the soldering process, improving product quality. However, because the aperture on the printed circuit board to be crimped is too small, the number of pins of the connector is too large, and the density is too high. When crimping, the lower die is slightly deviated from the printed circuit board. On...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/24
CPCH01R43/24
Inventor 王芳李绘娟劳文贞
Owner 武汉数字工程研究所
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