High-heat-dissipation semiconductor laser

Abstract

The invention discloses a high-heat-dissipation semiconductor laser. The high-heat-dissipation semiconductor laser comprises a cooling base, wherein a cooling channel which is formed in the length direction of the cooling base is formed in the cooling base; one end of a buffer mechanism is welded on the top of the cooling base; a placement base is welded at the other end of the buffer mechanism; the buffer mechanism is used for buffering vibration force transferred between the cooling base and the placement base; a placement groove is formed in the top of the placement base; a heat conducting plate is fixedly mounted on the inner wall at the bottom of the placement groove; a semiconductor laser chip mounting assembly positioned in the placement groove is arranged on the heat conducting plate; clamping grooves are formed in the inner walls on the two sides of the placement groove respectively; and a push rod moor is fixedly mounted on the inner wall on one side, far from a clamping groove opening, of each clamping groove through a bolt separately. The high-heat-dissipation semiconductor laser has buffering capability, and is convenient to detach and assemble, capable of realizing dual heat dissipation, high in heat dissipation efficiency, high in heat dissipation speed, simple in structure and convenient to use.

Description

technical field [0001] The invention relates to the technical field of lasers, in particular to a semiconductor laser with high heat dissipation. Background technique [0002] With the continuous improvement of output power, conversion efficiency and performance stability of semiconductor lasers, high-power semiconductor lasers are more widely used in industry, medical treatment and military affairs, with huge market demand and broader development prospects. [0003] The patent document with application number 201010198093.5 discloses a replaceable chip horizontal array high-power semiconductor laser, which is used to provide a replaceable chip horizontal array high-power semiconductor laser. This semiconductor laser consists of multiple independent chip mounting components Composition, multiple chip mounting components share a cooler, and the heat dissipation between the chip mounting components will not affect each other, but its heat dissipation efficiency is low, and it ...

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Problems solved by technology

[0003] The patent document with application number 201010198093.5 discloses a replaceable chip horizontal array high-power semiconductor laser, which is used to provide a replaceable chip horizontal array high-power semiconductor laser. This semiconductor laser consists of multiple independent chip mounting components Composition, multiple chip mounting components share a cooler, and the heat dissipation between the chip mounting components will not affect each other, but its heat dissipation efficiency is low, and it is easy to accumulate heat during use and cause damage to the semiconductor laser chip mounting components

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