Temperature measurement tool for heating disc in PECVD equipment

Abstract

The invention discloses a temperature measurement tool for a heating disc in PECVD equipment, and the tool comprises a temperature measurement head, a substrate, and a fixed part. The substrate is parallel to the upper surface of a disposition heating disc, and the temperature measurement head is fixed in a circular hole of the substrate through the fixed part. The temperature measurement head is connected with a temperature measurement instrument through a data line. The tool cannot damage the surface layer and subsurface layer of the heating disc and the equipment, employs a surface multi-point measurement mode, can carry out the selective testing of the temperature of each point on the heating disc according to the needs, improves the testing data integrity and flexibility, employs the thicker substrate, solves a problem of inaccurate testing results caused by that a conventional thinner substrate is liable to be warped under high temperature, is simple in structure, is easy to machine, and is easy to use for testing of the heating disc.

Description

technical field [0001] The invention relates to a temperature measuring tool, in particular to a temperature measuring tool used for a heating plate in a PECVD equipment, and belongs to the technical field of semiconductor equipment. Background technique [0002] The temperature measurement method of the heating plate in traditional PECVD equipment can only test a few fixed points. The limited number of test points makes it impossible to accurately judge the temperature value of each point in the heating plate, and the traditional temperature measurement method is easily affected by temperature, causing warping. The curve causes the test value to be inaccurately reflected. Contents of the invention [0003] Aiming at the deficiencies of the above-mentioned prior art, the present invention provides a temperature measuring tool for a heating plate in a PECVD equipment. [0004] In order to achieve the above object, the technical solution adopted by the present invention is:...

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Problems solved by technology

[0002] The temperature measurement method of the heating plate in traditional PECVD equipment can only test a few fixed points. The limited number of test points makes it impossible to accurately judge the temperature value of each point in the heating plate, and the traditional temperature measurement method is easily affected by temperature, causing warping. The curve causes the test value to not be accurately reflected

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