Method for producing an electronic module in particular for a motor vehicle transmission control unit

A technology of electronic modules and sensors, applied in the direction of mechanical equipment, transmission control, electrical equipment casing/cabinets/drawers, etc., can solve expensive and troublesome problems, and achieve the effect of reducing assembly costs

Inactive Publication Date: 2017-04-26
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, placing and / or fixing components on such printed circuit board components can be cumbersome and expensive

Method used

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  • Method for producing an electronic module in particular for a motor vehicle transmission control unit
  • Method for producing an electronic module in particular for a motor vehicle transmission control unit
  • Method for producing an electronic module in particular for a motor vehicle transmission control unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] figure 1 An electronic module 10 produced according to the invention is shown, which is used, for example, as a transmission control module in a transmission control system.

[0034] The electronics module 10 has a carrier plate 12 which can be a metal plate or a metal-plastic composite plate. In particular, the carrier plate 12 can be used as a heat sink for the electronics module 10 and is provided for heat dissipation.

[0035] On the side 13 of the carrier plate 12 a printed circuit board element 14 is arranged completely planarly. For example, the printed circuit board element 14 can be glued, soldered and / or welded to the side 13 of the carrier plate 12 with the outer side 15 .

[0036] As described above and in more detail below, two sensor elements 18 are arranged and fixed according to the invention on the outer surface 16 of the printed circuit board element 14 which is situated opposite the outer side 15 . The sensor element 18 can be a so-called sensor do...

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PUM

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Abstract

A method for producing an electronic module (10) is proposed in which a sensor element (18) having a mounting device (30) is attached to an external surface (16) of a printed circuit board element (14), wherein the sensor element (18) has a sensor area (22) and a base area (20) that can be plasticized at least in sections. The method is characterized in particular in that the base area (20) is plasticized up to a plasticization length (44) that is measured from the base surface (19) of the sensor element (18) in a z direction (24); the plasticized base area (20) and the external surface (16) of the printed circuit board element (14) are joined together such that the sensor area (22) is arranged with a defined positioning accuracy at a target distance (50) to a reference point (36a) which is fixed relative to the external surface (16), and the plasticized base area (20) is subsequently solidified, wherein the positioning accuracy is smaller than the plasticization length (44). As a result of this, the sensor area (22) can be arranged with accuracy at the target distance (50) independently of the component tolerance of the printed circuit board element (14) and/or of the sensor element (18), which accuracy is exclusively determined by the mounting device (30).

Description

technical field [0001] The invention relates to a method for producing an electronic module having a printed circuit board element and a sensor element arranged on the printed circuit board element, such that the sensor element can be used in particular for a motor vehicle transmission control device like that. Background technique [0002] Electronic modules are often used to construct electrical switching circuits. The electrical switching circuit can, for example, be part of a control device. In vehicle construction, electronic modules are used in particular to provide vehicle control units, such as, for example, a transmission control unit. In an electronic module, a plurality of electronic components such as for example sensors, connector elements, capacitors and / or other components are typically arranged at the printed circuit board element, said plurality of electronic components being connected by means of conductor circuits to are electrically connected to each o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30H05K5/00F16H61/00
CPCF16H61/0006H05K3/303H05K3/305H05K5/0082H05K2201/0129H05K2201/10151H05K2203/081Y02P70/50
Inventor U.利斯科夫
Owner ROBERT BOSCH GMBH
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