Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Inkjet printing system and method of processing wafers

An inkjet printing, wafer technology, applied in printing, printed circuit, printed circuit, etc., can solve the problem of expensive sliders for sports cameras

Active Publication Date: 2019-10-15
MEYER BURGER NETHERLANDS BV
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This sturdy movable camera slide is expensive

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Inkjet printing system and method of processing wafers
  • Inkjet printing system and method of processing wafers
  • Inkjet printing system and method of processing wafers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The drawings illustrate examples of inkjet printing systems in which various embodiments of the invention are incorporated. It should be noted that the embodiments can also be applied independently and that the invention is not limited to the examples shown in the drawings. Various embodiments will be described below, wherein reference numerals will be used to refer to the accompanying drawings. Reference numerals are used herein for the purpose of description and do not have a limiting effect. Embodiments can also be implemented differently than the examples shown in the drawings.

[0039] In general, the present disclosure relates to an inkjet printing system 10 configured to print a pattern of liquid material onto a wafer W supplied at a high volume. An example of such an inkjet printing system 10 is in figure 1 shown in .

[0040] Each wafer W has wafer edges W extending in at least two different directions e . The system includes at least one chuck 14 on whic...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Inkjet printing system and method for processing wafers, Inkjet printing system (10) for processing high volume wafers (W). The inkjet printing system includes a chuck (14) on which a wafer (W) can be placed, and an inkjet printhead (16) having at least one nozzle. Each collet is associated with a single camera (26). Each chuck includes 2D visual fiducials. The electronic controller assembly (22, 24) is configured to take a single image containing the edge of the wafer and the two-dimensional visual fiducial in each instance the wafer has been placed on the chuck. For each image (I), the position of the collet (14) relative to the camera (26) and the position of the wafer (W) relative to the camera (26) are determined. Subsequently, the position of the wafer relative to the chuck is calculated, and based thereon, the firing of at least one nozzle is timed, and the movement of the printing action assembly is controlled such that droplets are precisely positioned on the wafer.

Description

technical field [0001] The present invention relates to inkjet printing systems and methods for processing wafers. More particularly, the present invention relates to printing systems and methods for processing high volume wafers in a short period of time. Background technique [0002] US 6,436,843 B1 discloses a method for applying a coating material on a substrate, wherein a print head is arranged above a substrate which is supported by a chuck. A digital signal processor provides control signals for controlling process parameters for dispensing droplets of coating material and for controlling the relative positions of the print head and the chuck. The way of determining the relative position between the print head and the cartridge is not disclosed. [0003] US 2007 / 169806 A1 discloses a printing assembly comprising a print head mounted in a rigid mount and a camera with high magnification capability. A rigid mount with the print head and the camera is mounted on a con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/12H01L21/68H01L21/67B41J29/393B41J11/00B41J3/407
CPCB41J3/407B41J11/008B41J29/393H01L21/67282H01L21/681H05K1/0269H05K3/125H05K2203/166H05K2201/09918B41J2/01B41J11/58
Inventor 约翰·维黑杰劳伦修斯·亨德瑞库斯·阿德里安努斯·万蒂耶克
Owner MEYER BURGER NETHERLANDS BV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com