Heating plate horizontal measurement tool structure and measurement method

Abstract

The invention discloses a heating plate horizontal measurement tool structure and a measurement method, mainly for solving the problems of complexity and difficult operation by use of a conventional measurement method. The tool structure comprises a positioning pedestal, fastening digital display dial gauge bolts, a fixation frame, positioning pins, fastening bolts and digital display dial gauges, wherein the positioning pedestal is placed on a reaction chamber, the lower surface of a disc of the positioning pedestal is superposed with a positioning reference on the reaction chamber, the reference is enabled to move downwards to positioning holes in the three dial gauges of the positioning pedestal, the positioning holes of the dial gauges of the positioning pedestal can ensure that the three digital display dial gauges perform measurement in the same horizontal plane and are uniformly distributed on the surface of a heating plate at angles of 120 degrees. The measurement method is as follows: through cooperation between the positioning pedestal and the fixation frame, horizontal positioning, clamping and measurement position location of the digital display dial gauges are completed, the heating plate is adjusted to enable readings of the three digital display dial gauges to be the same, and at the moment, the heating plate is horizontal. The structure is reasonable, the operation method is simple, and the work efficiency of horizontal adjustment of the upper surface of the heating plate is effectively improved. The structure and the method can be widely applied to the technical field of semiconductor film plating equipment.

Description

technical field [0001] The invention relates to a tooling structure and method for measuring the level of a heating plate, in particular to a device that uses a fixed and accurate positioning digital display dial indicator, which is convenient for the digital display dial indicator to measure the levelness of the heating plate in the cavity when it is installed. Method and tooling structure. The invention belongs to the application technical field of semiconductor coating equipment. Background technique [0002] With the increase in demand for electronic products, the rapid development of semiconductor equipment is driven. The heating plate is a key component widely used in the silicon wafer deposition reaction chamber in semiconductor equipment. The environmental requirements for silicon wafer deposition are very high, including the height level of the heating plate on which the silicon wafer is placed. The level of the heating plate directly affects the quality of the sil...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the above-mentioned problems, and mainly solve the technical problems that the existing measuring methods are relatively complicated and difficult to operate, and provide a measuring tool for the surface level of the heating plate, which simplifies the installation and operation process of the digital display dial indicator, and enhances the three The reliability and identity of the positioning of the digital display dial gauge improves the efficiency and accuracy of the level adjustment of the upper surface of the heating plate

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