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Flexible pressure sensor and preparation method therefor

A pressure sensor, flexible technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, measurement of elastic deformation force by measuring gauges, etc., can solve the needs of Annealing etc.

Inactive Publication Date: 2017-03-22
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sensitivity of the sensor needs to be improved, and the combination of the sensitive layer and the substrate needs annealing treatment

Method used

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  • Flexible pressure sensor and preparation method therefor
  • Flexible pressure sensor and preparation method therefor
  • Flexible pressure sensor and preparation method therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] This embodiment provides a flexible pressure sensor, which includes an upper flexible substrate and a lower flexible substrate arranged in parallel, an upper sensitive layer conformally attached to the lower surface of the upper flexible substrate and an upper sensitive layer conformally attached to the upper surface of the lower flexible substrate. The lower sensitive layer; the upper sensitive layer is provided with an upper electrode, the lower sensitive layer is provided with a lower electrode, and the upper electrode and the lower electrode are respectively arranged on the edge of the upper sensitive layer and the lower electrode On the side of the sensitive layer, the upper electrode and the lower electrode do not cross each other; a contactable area is formed between the upper sensitive layer and the lower sensitive layer. An encapsulation layer 4 is contained outside the upper flexible substrate and the lower flexible substrate, such as figure 1 shown. Wherein,...

Embodiment 2

[0084] This embodiment provides a flexible pressure sensor. The structure of the flexible pressure sensor is the same as that in Embodiment 1.

[0085] This embodiment also provides a preparation method for the above-mentioned flexible pressure sensor, and the specific steps are as follows:

[0086] Step 1. Mix the precursor of polydimethylsiloxane and the curing agent evenly according to the ratio of 10:1, and drop-coat it on the surface of the cleaned and dried fresh pothos leaves;

[0087] Step 2. After the polydimethylsiloxane is basically flat on the surface of the blade, place it in an oven at 80°C to cure for 3 hours. After the curing is complete, remove the polydimethylsiloxane film to obtain a substrate with a microstructure;

[0088] Step 3. The carbon nanotube film is directly extracted from the vertical carbon nanotube array, with a width of 2 cm, placed on the surface of the copper foil, and ethanol is added dropwise, and the carbon nanotube film is firmly bonded...

Embodiment 3

[0097] This embodiment provides a flexible pressure sensor. This embodiment provides a flexible pressure sensor. The structure of the flexible pressure sensor is the same as that in Embodiment 1.

[0098] This embodiment also provides a preparation method for the above-mentioned flexible pressure sensor, and the specific steps are as follows:

[0099] Step 1. Mix the precursor of polydimethylsiloxane and the curing agent evenly according to the ratio of 10:1, and drop-coat it on the surface of the cleaned and dried fresh pothos leaves;

[0100] Step 2. After the polydimethylsiloxane is basically flat on the surface of the blade, place it in an oven at 70°C to cure for 3 hours. After the curing is completed, remove the polydimethylsiloxane film to obtain a substrate with a microstructure. The thickness of the flexible substrate is 250 μm;

[0101] Step 3, the carbon nanotube film is directly extracted from the vertical carbon nanotube array, placed on the surface of the copp...

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Abstract

The invention provides a flexible pressure sensor and a preparation method therefor. The flexible pressure sensor comprises an upper flexible substrate and a lower flexible substrate which are arranged oppositely in parallel, an upper sensitive layer which is attached to the lower surface of the upper flexible substrate in a conformal manner and a lower sensitive layer which is attached to the upper surface of the lower flexible substrate in a conformal manner, wherein the upper sensitive layer is provided with an upper electrode while the lower sensitive layer is provided with a lower electrode; the upper electrode and the lower electrode are not crossed mutually; a contact region is formed between the upper sensitive layer and the lower sensitive layer; multiple multi-stage lug bosses are arranged on the lower surface of the upper flexible substrate and the upper surface of the lower flexible substrate respectively; and the multi-stage lug bosses are 50-100[mu]m in average lengths and 1-10[mu]m in average heights. The flexible pressure sensor provided by the invention has the flexible substrates which are obtained by impression and have special convex microstructures, so that the surface roughness is improved, and the sensitivity of the sensor is greatly improved.

Description

technical field [0001] The invention relates to the technical field of pressure detection, and more specifically, to a flexible pressure sensor and a preparation method thereof. Background technique [0002] In recent years, with the development of smart wearable electronics, flexible electronic devices have shown great application prospects in medical (human physiological signal detection and motion detection, etc.), energy, information, military and other fields. Among them, the pressure sensor is an electronic device that converts the pressure felt by the outside world into electrical and other signals, and is widely used in wearable electronic devices. In order to realize real-time monitoring of human physiological signals, pressure sensors need to meet high performance indicators such as high flexibility, high sensitivity, high stability, and low detection limit. However, traditional bulky mechatronics are difficult to meet the requirements. Therefore, the development...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/01H01L41/083H01L41/22G01L1/04H10N30/01H10N30/50
CPCH01L27/01G01L1/04H10N30/50H10N30/01
Inventor 张莹莹蹇木强夏凯伦
Owner TSINGHUA UNIV
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