Server node and server

A server node and function technology, applied in the server field, can solve problems such as poor server heat dissipation, affecting CPU heat dissipation, and reduced air intake

Inactive Publication Date: 2017-03-22
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the hard disk blocks the CPU heat dissipation air duct, the air intake of the CPU becomes smaller, which affects the heat dissipation of the CPU.
In addition, the IO card is installed behind the CPU and memory sticks in the air intake direction of the air inlet channel. The computing processing components such as the CPU and memory sticks will dissipate heat during work, so that the airflow passing through the CPU and memory will be further heated. The airflow temperature is already high, causing the heat dissipation of the IO card to become a bottleneck
[0004] Therefore, adopting the current structure in which the components on the motherboard are sequentially arranged in the air inlet direction of the air inlet channel, the heat dissipation effect of the entire server is not good.

Method used

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  • Server node and server
  • Server node and server
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Embodiment Construction

[0030] The technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0031] The server nodes and servers provided by the embodiments of the present invention can be applied to figure 1 In the network architecture shown. figure 1 In the shown network architecture, the server includes a plurality of server nodes, and the server nodes in each server are connected to Ethernet through a switch and communicate. Wherein, the server may be a blade server or a high-density server, and the server node may be a blade server node or a high-density server node. Taking the server as a blade server and the server node as a blade server node as an example, the structural diagram between the server and the server node is as follows figure 2 shown.

[0032] In th...

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Abstract

The invention discloses a server node and a server. A calculation processing part and a function expansion part in the server node are arranged on different surfaces of a mainboard, and are connected and communicate through the mainboard. The mainboard comprises a first surface and a second surface; the first surface and a server node housing form a first space; the second surface and the server node housing form a second space; the first space is isolated from the second space; and the first space and the second space are provided with air inlet channels independent of each other. The structure of the server node can improve the cooling effect of the server.

Description

technical field [0001] The invention relates to the field of servers, in particular to a server node and a server. Background technique [0002] With the development of cloud computing, big data, mobile Internet and Internet of Things, software-defined storage (Software Defined Storage, SDS), software-defined network (Software Defined Network, SDN), software-defined data center (Software Defined Data Center, SDDC), The rapid development of new technologies such as Network Function Virtualization (NFV) has put forward higher requirements for the form and configuration of servers. [0003] At present, in various forms of servers, the components installed on the motherboard in each server node, such as hard disk, central processing unit (Central Processing Unit, CPU), memory stick, input / output (Input / Output, I / O) card etc. generally adopt the structure that the air inlet channel is sequentially arranged on the main board in the air inlet direction, and the heat dissipation ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18
CPCG06F1/185
Inventor 姚益民高俊恩
Owner HUAWEI TECH CO LTD
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