A photon counting detector array and its imaging method

Abstract

The invention provides a photon counting detector array and an imaging method thereof. The photon counting detector array comprises multiple detector modules, and each of the detector modules is formed by two or more photon counting detector units. A detector matrix is formed by arranging the multiple detector modules in a plane, wherein the multiple photon counting detector units are in an equal interval arrangement in each column and in a dislocation arrangement in two adjacent columns, or the multiple photon counting detector units are in the equal interval arrangement in each row and in a dislocation arrangement in two adjacent rows in the detector matrix. Through the translation or rotation of the photon counting detector array, two staggered complementary netted images are obtained, then the two netted images are connected, and a plane seamless connection image of an effectively imaging area can be obtained. Based on the three-surface splicing photo counting detector units, the photon counting detector array for obtaining the plane seamless connection image is formed, the system design complexity is simplified, and the system cost is reduced.

Description

technical field [0001] The present invention relates to a photon counting detector array. The present invention also relates to an imaging method for plane seamless splicing images realized by using the photon counting detector array, and belongs to the technical field of radiation imaging. Background technique [0002] The photon counting detector is a new type of radiation imaging device, which is composed of a detector and a readout chip through solder ball flip-chip. Each detector and readout chip includes an M×N array of pixel units. Detectors mainly include silicon (Si), gallium arsenide (GaAs), cadmium telluride (CdTe), cadmium zinc telluride (CdZnTe) and other semiconductor detectors, which directly convert X photons into charges through the photoelectric effect of X-rays and detectors Signal. The charge signal of each detector pixel unit is coupled to the input terminal of the pixel unit of the readout chip through flip-chip solder balls, and then undergoes succes...

AI Technical Summary

Problems solved by technology

However, this splicing method, because the silicon vias still need to occupy a certain chip area, realizes seamless splicing from the structural point of view, but there are still splicing gaps from the image

At the same time, this packaging method has low yield and high cost, and is not suitable for batch products.

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