MEMS microphone encapsulation
A microphone and ASIC chip technology, applied in the field of acoustic and electrical products, can solve the problems of high electrical signal transmission consumption, poor product reliability, electrical signal distortion, etc., and achieve the effects of low transmission consumption, low production cost, and improved performance and reliability.
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[0014] See figure 2 , a MEMS microphone package, including an upper PCB board 1 and a lower PCB board, the upper PCB board 1 is provided with a MEMS chip 2 and an ASIC chip 3, the ASIC chip is NJU72082G, the MEMS chip is NJD3005e, and the BIAS of the MEMS chip 2 The port is connected to the BIAS port of the ASIC chip 3 through a gold wire 4, the VOUT port of the MEMS chip 2 is connected to the MICIN port of the ASIC chip 3 through a gold wire, and the VDD port of the ASIC chip 3 is connected to the VDD soldering port on the front side of the upper PCB board 1 through a gold wire. Disk 5, the OUT port of the ASIC chip 3 is connected to the output pad 6 arranged on the front of the upper PCB board 1 through a gold wire, and the GND port of the ASIC chip 3 is connected to the ground pad 7 arranged on the front of the upper PCB board 1 through a gold wire. The first copper layer 8 and the second copper layer 9 are arranged between the PCB 1 and the lower PCB, and the VDD pad 5 is...
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