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Display panel mother board and preparation method of display panel

A technology for display panels and manufacturing methods, applied in the fields of final product manufacturing, sustainable manufacturing/processing, identification devices, etc., capable of solving deformation and damage of flexible substrates and display components, affecting the electrical performance of display components, and yield decline, etc. problems, to achieve the effect of ensuring the stripping yield, improving the stripping yield, and good performance

Active Publication Date: 2017-02-22
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] However, in the above-mentioned process of peeling the flexible display panel and the rigid substrate to obtain the flexible display panel, if the operation is improper, it is easy to cause problems such as poor peeling, deformation and damage of the flexible substrate and display components, and excessive residues after separation. , affecting the electrical properties of display components, resulting in a drop in yield, which is an urgent problem that needs to be solved in flexible display devices

Method used

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  • Display panel mother board and preparation method of display panel
  • Display panel mother board and preparation method of display panel
  • Display panel mother board and preparation method of display panel

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Embodiment Construction

[0062] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0063] refer to figure 1 , the first aspect of the present invention relates to a display panel motherboard 100 . Wherein, the display panel motherboard 100 includes a rigid substrate 110 and a flexible substrate 120 , and the rigid substrate 110 is disposed opposite to the flexible substrate 120 .

[0064] The display panel motherboard 100 also includes a liquid affinity adjustable layer 130 . Wherein, the liquid affinity adjustable layer 130 is arranged between the rigid substrate 110 and the flexible substrate 120 , and the liquid affinity adjustable layer 130 bonds the flexible substrate 120 to the rigid substrate 110 .

[0065] It should be noted that th...

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Abstract

The invention discloses a display panel mother board and preparation method of display panel, belonging to the technical field of displaying. The display panel mother board includes a rigid substrate and a flexible substrate, the display panel mother board yet includes a liquid affinity adjustable layer provided between the rigid substrate and the flexible substrate, the flexible substrate is adhered to the rigid substrate by the liquid affinity adjustable layer. The liquid affinity adjustable layer in the method of display panel mother board can increase the stripping yield of the display panel mother board.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display panel mother board and a display panel manufacturing method. Background technique [0002] In general, flexible display devices are made of very thin flexible substrates. Compared with traditional displays, flexible display devices have the advantages of ultra-thin, light weight, durability, large storage capacity, free design, and rollability. They have been widely used in Display products, especially for mobile communication devices. At present, the research on flexible display devices mainly includes flexible organic electroluminescent display (Flexible Organic Light Emitting Diode, FOLED), flexible electronic ink display, also known as flexible electrophoretic display (Flexible Electrophoretic Display, FEPD) and flexible liquid crystal display (Flexible Liquid Crystal). Display, FLCD). [0003] The substrate of the display panel of the above-mentioned flexible di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/30
CPCG09F9/301G02F1/133305Y02E10/549Y02P70/50H10K71/191H10K71/80H10K77/111H10K2102/311H05K1/118
Inventor 徐元杰
Owner BOE TECH GRP CO LTD
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