Manufacturing method of fingerprint identification module

A fingerprint recognition module, fingerprint recognition technology, applied in character and pattern recognition, instruments, computing and other directions, can solve problems such as low production efficiency

Active Publication Date: 2019-02-19
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the manufacturing process of the fingerprint identification module has the problem of low production efficiency

Method used

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  • Manufacturing method of fingerprint identification module
  • Manufacturing method of fingerprint identification module

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0016] Such as figure 1 As shown, the embodiment of the present invention provides a method 100 for manufacturing a fingerprint identification module, including:

[0017] S110, bonding the motherboard of the fingerprint identification chip and the motherboard of the cover plate to form a first module, the motherboard of the fingerprint identification chip includes a plurality of fingerprint identification chips arranged in an array, and the motherboard of the cover pl...

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Abstract

The invention discloses a method for manufacturing a fingerprint recognition module, comprising: bonding a fingerprint recognition chip mother board and a cover board mother board to form a first module, the fingerprint recognition chip mother board is composed of arrayed A whole motherboard of a plurality of fingerprint identification chips, the cover motherboard includes a plurality of cover panels arranged in an array; the first module is cut to separate a second module, and the second module includes The fingerprint identification chip and the cover plate bonded together; attaching the second module on the flexible circuit board so that the fingerprint identification chip is located between the flexible circuit board and the cover plate , to make the fingerprint identification module. The manufacturing method of the fingerprint identification module provided by the invention can improve the production efficiency.

Description

technical field [0001] The invention relates to the field of fingerprint identification, in particular to a method for manufacturing a fingerprint identification module. Background technique [0002] With the rise of fingerprint identification technology, as the carrier of fingerprint identification technology, fingerprint identification modules are widely used in terminal equipment, and fingerprint identification function has gradually become a standard function of terminal equipment. In the prior art, there is a problem of low production efficiency in the manufacturing process of the fingerprint identification module. Contents of the invention [0003] In view of this, the present invention provides a method for manufacturing a fingerprint recognition module, which can improve production efficiency. [0004] A method for manufacturing a fingerprint identification module, comprising: bonding a fingerprint identification chip motherboard and a cover motherboard to form a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00
CPCG06V40/13
Inventor 邱在良
Owner NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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