Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Parallel simulation processing method of gate-level circuit and computer readable storage medium

A gate-level circuit and processing method technology, applied in the direction of electrical digital data processing, computer-aided design, calculation, etc., can solve the problem of high hardware cost, achieve the effect of reducing the number of cuts and avoiding inconvenience

Pending Publication Date: 2021-07-09
SHENZHEN STATE MICRO TECH CO LTD
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the technical problem of high hardware cost caused by high-performance hardware for simulation acceleration in the prior art, the present invention proposes a parallel simulation processing method for gate-level circuits and a computer-readable storage medium

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Parallel simulation processing method of gate-level circuit and computer readable storage medium
  • Parallel simulation processing method of gate-level circuit and computer readable storage medium
  • Parallel simulation processing method of gate-level circuit and computer readable storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0060] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0061] Thus, a feature indicated in this specification will be used to describe one of the features of an embodiment of the present invention, rather than implying that every embodiment of the present invention must have the described feature. Furthermore, it should be noted that this specification describes a number of features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly described. Thus, the illustrated combinations are not intended to be limiting unless oth...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a parallel simulation processing method of a gate-level circuit and a computer readable storage medium. The parallel simulation processing method of the gate-level circuit comprises the following steps: based on an adjacent matrix of the gate-level circuit, segmenting a graph corresponding to the gate-level circuit into a plurality of clusters by adopting a first preset segmentation algorithm; taking each cluster as a superpoint, and packaging data of each superpoint by adopting a first data structure; on the basis of a superpoint diagram formed by all the superpoints, dividing all the superpoints into a plurality of partitions capable of being processed in parallel by adopting a second preset segmentation algorithm, and packaging partition data by adopting a second data structure; generating a cluster priority event queue between clusters and a node priority event queue in the clusters by adopting a preset priority distribution algorithm on the basis of the super-point data and the partition data; and simulating the gate-level circuit according to a simulation sequence defined by the priority event queue. According to the invention, the simulation efficiency of the gate-level circuit can be effectively improved, and the simulation complexity of the gate-level circuit is reduced.

Description

technical field [0001] The invention relates to the technical field of gate-level circuit simulation, in particular to a parallel simulation processing method capable of improving gate-level circuit simulation efficiency. Background technique [0002] With the continuous development of integrated circuits, whether it is chip forward design or reverse design, they are more and more dependent on tools, which poses a higher challenge to the processing speed of related software. Completely free and open source digital chip simulators include Icarus Verilog, Yosys, etc. [0003] In the simulation process, due to the influence of the circuit design scale, the simulation time of circuits of different scales varies greatly. Large-scale circuit simulation takes a very long time, while for small-scale circuit simulation it takes microseconds. Accelerated circuit simulation is a chip Key issues that need to be effectively resolved in the simulation stage. The running speed of most so...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/367G06F30/327
CPCG06F30/367G06F30/327
Inventor 王玉皞徐子晨罗雨桑胡海川叶亮高景雄陈俊源黄国勇
Owner SHENZHEN STATE MICRO TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products