Micro cold and hot shock test device for electronic product

A technology of cold and thermal shock and test device, which is applied in measuring devices, instruments, scientific instruments, etc., can solve the problems of large environmental pollution, large space occupation, waste of energy, etc., achieve good thermal insulation effect, solve large space occupation, The effect of reducing the size of the device

Inactive Publication Date: 2017-01-11
成都尚智恒达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a miniature cold and heat shock test device for electronic products to solve the problems in the prior art that the electronic component test equipment occupies a large space, causes great environmental pollution and wastes energy

Method used

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  • Micro cold and hot shock test device for electronic product
  • Micro cold and hot shock test device for electronic product
  • Micro cold and hot shock test device for electronic product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Such as Figure 1-Figure 3 As shown, a miniature cold and thermal shock test device for electronic products includes a test body 1 and a test sample mounting base 2 that are movable up and down. The thermal insulation shell 12 is cylindrical with an open lower end, and a thermal insulation partition 13 is arranged inside the thermal insulation casing 12. The thermal insulation partition 13 and the test sample installation base 2 separate the thermal insulation casing 12 into a cold test room and a hot test chamber independently arranged on the left and right sides. In the laboratory, the upper half of the insulation partition 13 is inlaid with a semiconductor refrigeration device 14, and the semiconductor refrigeration device 14 is composed of a cold end surface 141, a hot end surface 142, a metal conductor 143, an N-type semiconductor 144, a P-type semiconductor 145 and a DC power supply 146. Composition, the material of the cold end face 141 and the hot end face 142 i...

Embodiment 2

[0031] Such as Figure 4-Figure 5 As shown, further optimization is carried out on the basis of a miniature thermal shock test device for electronic products described in Example 1, the inner wall of the heat preservation shell 12 is provided with a limiting block 15 and a sealing ring plate 16, and the limiting The block 15 is located below the semiconductor refrigeration device 14; the heat preservation shell 12 is provided with a movable sealing plate 17, and the movable sealing plate 17 is arranged between the limiting block 15 and the sealing ring plate 16, and the movable sealing plate 17 is installed on the base of the test sample. 2, the contact surface between the movable sealing plate 17 and the sealing ring plate 16 is provided with a sealing ring 19.

[0032] In this embodiment, the arrangement of the movable sealing plate 17 and the sealing ring plate 16 is to reduce the heat exchange between the cold test room and the hot test room and the environment when changi...

Embodiment 3

[0034] Such as Figure 6 As shown, further optimization is carried out on the basis of a miniature thermal shock test device for electronic products described in Example 2. The test sample mounting base 2 includes a cylindrical shell with an open upper end, and the outer shell of the shell The diameter is equal to the inner diameter of the heat preservation shell 12, and the inner wall of the shell is provided with an insulating layer, and the shell is provided with two upper plates 23 and two lower plates 25 sequentially from top to bottom, and between the upper plate 23 and the lower plate 25 A base partition 26 is provided, and the cavity 24 between the upper plate 23 and the lower plate 25 is divided into left and right parts corresponding to the cold test room and the hot test room, and several threaded through holes are evenly distributed on the upper plate 23 231, the upper plate 23 is connected to the movable sealing plate 17 on the same side, a number of small holes a...

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PUM

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Abstract

The invention discloses a micro cold and hot shock test device for an electronic product and relates to the field of testing of electronic products. The micro cold and hot shock test device comprises a test body and a test sample mounting base which are movably connected up and down, wherein a support sheathes outside the test body, the test body comprises a thermal insulation shell which is cylindrical with the lower end open, a thermal insulation separating plate is arranged in the thermal insulation shell, the thermal insulation separating plate separates the thermal insulation shell into a cold test chamber and a hot test chamber which are independently arranged left and right, a semiconductor refrigeration device is inlaid at the upper half part of the thermal insulation separating plate, the cold end face and the hot end face of the semiconductor refrigeration device are respectively extended into the cold test chamber and the hot test chamber. After energization, energy transfer can be realized, cooling and warming are respectively carried out in the cold test chamber and the hot test chamber, equipment size is greatly reduced, no refrigerant is needed, thermal insulation effect of the device is good, and the problems that electronic component test equipment occupies large space, environmental pollution is serious and energy is wasted in the prior art are solved.

Description

technical field [0001] The invention relates to the field of electronic product testing, in particular to a miniature thermal shock test device for electronic products. Background technique [0002] The hot and cold test chamber, also known as the "hot and cold shock test chamber", is a testing device that can instantly switch from high temperature to low temperature. It is used to test material structures or composite materials. To the extent that it can endure, the chemical changes or physical damage caused by thermal expansion and contraction of the sample can be detected in the shortest time. [0003] The existing cold and hot test chambers are bulky, require a large floor space, and are inconvenient to move; the price is expensive, costing tens of thousands of yuan, which is difficult for ordinary small enterprises to bear; a large amount of refrigerant is required during the test, which pollutes the environment Large; when testing microelectronic components, due to th...

Claims

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Application Information

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IPC IPC(8): G01N3/60G01N3/02
CPCG01N3/60G01N3/02
Inventor 任无史晓莉
Owner 成都尚智恒达科技有限公司
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