Heat radiating integrated LED lamp

Abstract

The invention discloses a heat radiating integrated LED lamp. The heat radiating integrated LED lamp comprises a radiator (5), a high thermal conductivity insulating layer (6), a circuit layer (3), a solder mask layer (4), a chip mounting or packaging layer (2) and a lampshade (1); the high thermal conductivity insulating layer (6) is directly generated on the front face of the radiator (5) through oxidization of materials of the radiator (5), circuits are made on the surface of the high thermal conductivity insulating layer (6) to generate the circuit layer (3), and the solder mask layer (4) is formed by printing electric insulating oil on the surface of the circuit layer (3) according to the making method of a circuit board; the radiator (5), the circuit layer (3), the high thermal conductivity insulating layer (6) and the solder mask layer (4) form a whole; the chip mounting or packaging layer (2) is installed on the whole in a paster or packaging manner, and the outer edge of the radiator (5) is connected with the lampshade (1) to form a closed space; and the radiator (5) is made of a metal material with the excellent heat-conducting property. According to the heat radiating integrated LED lamp, as electronic parts and components are directly packaged or pasted to the radiator (5), and heat generated by the electronic parts and components is directly conducted through metal pieces, the heat conduction efficiency is high, and the service life of the overall lamp is prolonged.

Description

[0001] The invention relates to the field of lighting fixtures, in particular to a heat dissipation integrated LED lamp. Background technique [0002] The heat conduction method of traditional LED lights: the chip (that is, the heating part) is packaged on the base of the bracket, and then mounted on the circuit board by welding, and then glued to the inner wall of the radiator by heat-conducting adhesive, from the chip to the radiator. , after the support, solder paste, copper foil, insulating layer, base material, thermally conductive adhesive and other layers, the heat conduction and heat dissipation efficiency will be affected. The electrostatic breakdown and carbonization of the organic insulating adhesive layer of the existing circuit board substrate will lead to leakage, light Fading, power burnout, LED failure and other issues. Contents of the invention [0003] (1) Technical problems to be solved [0004] The technical problem to be solved by the present invention ...

AI Technical Summary

Problems solved by technology

[0002] The heat conduction method of traditional LED lights: the chip (that is, the heating part) is packaged on the base of the bracket, and then mounted on the circuit board by welding, and then glued to the inner wall of the radiator by heat-conducting adhesive, from the chip to the radiator. , after the support, solder paste, copper foil, insulating layer, base material, thermally conductive adhesive and other layers, the heat conduction and heat dissipation efficiency will be affected. The electrostatic breakdown and carbonization of the organic insulating adhesive layer of the existing circuit board substrate will lead to leakage, light Fading, power burnout, LED failure, etc.

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