Silicon slice taking mechanism, taking method of silicon slice taking mechanism and silicon slice testing and sorting equipment

Abstract

A silicon slice taking mechanism comprises a rack, a sliding plate and a taking belt; the sliding plate is slidably installed on the rack, the taking belt is connected between the rack and the sliding plate, and the rack is provided with a first driving piece and a second driving piece, wherein the first driving piece is used for driving the sliding plate to stretch and retract, and the second driving piece is used for driving the taking belt to operate. The taking method of the silicon slice taking mechanism comprises the following steps that the first driving piece drives the sliding plate to stretch into a silicon slice box, and the taking belt enters the silicon slice box with the sliding plate; the first driving piece stops to act, the second driving piece drives the taking belt to operate, silicon slices in the silicon slice box sequentially fall onto the taking belt and are conveyed away; and after transporting of the silicon slices in the silicon slice box is completed, the second driving piece stops to act, the first driving piece drives the sliding plate to retract back to the initial position, and the taking belt exits from the silicon slice box with the sliding plate. Silicon slice testing and sorting equipment comprises the silicon slice box, a conveying belt, a positioning mechanism, a testing bench, a sorting mechanism and the silicon slice taking mechanism in sequence; and the taking belt is located between the silicon slice box and the conveying belt.

Description

technical field [0001] The invention relates to solar cell manufacturing technology, in particular to a silicon chip retrieving mechanism, a retrieving method thereof and a silicon chip testing and sorting device. Background technique [0002] Wafer testing and sorting refers to testing the performance parameters of silicon wafers and classifying them according to the test results. Silicon wafer testing and sorting equipment mainly includes a retrieving mechanism, a conveyor belt, a positioning mechanism, a test bench and a sorting mechanism. [0003] The existing silicon wafer retrieving mechanism usually uses an electric slide table or a linear motor to drive the vacuum suction cup to slide horizontally. After the vacuum suction cup takes out the silicon wafers in the silicon wafer box, it drives the vacuum suction cup to move to the top of the conveyor belt, and then the vacuum suction cup stops. Suction transfers the silicon wafers to the conveyor belt. In this process,...

AI Technical Summary

Problems solved by technology

In this process, the electric slide table or linear motor needs to reciprocate once to take out a silicon wafer, and in the process of reciprocating motion, acceleration and deceleration are required, which limits the capacity limit that can be achieved by this method and cannot meet the capacity. Require

In addition, this method of retrieving materials has a poor connection with the silicon wafers conveyed by the belt in the subsequent process, which makes the equipment structure more complicated and the cost higher

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