Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-throughput composite material chip, preparation method and preparation device thereof

A technology of combining material chips and preparation devices, applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problems of low preparation efficiency, achieve high-efficiency preparation, reduce space occupation, and improve preparation efficiency Effect

Active Publication Date: 2019-05-21
成都芯曌科技有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the technical problem of low preparation efficiency of existing high-throughput combined material chips, the present invention provides a high-throughput combined material chip and its preparation method and preparation device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-throughput composite material chip, preparation method and preparation device thereof
  • High-throughput composite material chip, preparation method and preparation device thereof
  • High-throughput composite material chip, preparation method and preparation device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] see figure 1 and figure 2 The first embodiment of the present invention provides a high-throughput combined material chip preparation device 1, which includes a transition chamber 11, a feeding module 12, a preparation chamber 13, an evaporation module 14, an evaporation boat 15, an adjustment module 16, The first formwork module 17 , the second formwork module 18 , and the carrying mechanism 19 . The transition chamber 11 is disposed between the preparation chamber 13 and the external device 10 connected to the transition chamber 11, and is used to form a channel for doc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a preparation device of a high-throughput composed material chip. The preparation device comprises a preparation cavity, a raw material output device stretching into the preparation cavity, an evaporator module contained in the preparation cavity, a plurality of discrete masks and a continuous mask. The raw material output device is arranged between the evaporator module and the discrete masks / continuous mask and used for quantitatively supplying raw materials to the evaporator module when the air pressure in the raw material output device is the same as that in the preparation cavity. The evaporator module is used for evaporating the raw materials supplied by the raw material output device so that steam can be formed. The steam is deposited on a substrate through the discrete masks and / or the continuous mask, so that the high-throughput composed material chip is formed. The invention further relates to a preparation method of the high-throughput composed material chip adopting the preparation device and the high-throughput composed material chip prepared through the preparation method. According to the preparation device of the high-throughput composed material chip, the raw materials can be supplemented to the evaporator module without destroying the working air pressure, and thus the preparation efficiency of the chip can be improved.

Description

【Technical field】 [0001] The invention relates to the technical field of composite material chips, in particular to a high-throughput composite material chip, a preparation method and a preparation device thereof. 【Background technique】 [0002] Electron beam evaporation coating technology uses the cooperation of electromagnetic field to accurately realize the use of high-energy electrons to bombard the raw materials in the crucible, make them melt and evaporate and deposit on the substrate to form a coating. The traditional electron beam evaporation coating technology can prepare thin film materials with high purity and high precision. This technology can be used in the preparation of composite material chips, which can greatly increase the preparation and screening speed of new materials. Efficient means of material theory research such as synthesis process and verification theory research and calculation. At the same time, compared with other vacuum coating technologies,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/30
CPCC23C14/30
Inventor 闫宗楷向勇彭志蒋赵联李响
Owner 成都芯曌科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com