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Temporary bonding processing method of sheet workpiece

A processing method and a sheet-like technology, applied in the field of microelectronics, can solve the problems of high equipment cost, complex wafer processing procedures, and high processing cost, and achieve a simple process, simple and fast processing method, and low equipment cost and processing cost. Effect

Inactive Publication Date: 2016-12-07
ZHEJIANG MICROTECH MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the processing cost is high, and the equipment cost invested in the early stage is large.
In addition, during the use of the above-mentioned special equipment, its clamping and unloading process and the pretreatment process before the wafer is placed in the special equipment will cause the wafer processing process to be complicated and the production efficiency to be low, thus increasing the processing cost

Method used

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  • Temporary bonding processing method of sheet workpiece
  • Temporary bonding processing method of sheet workpiece
  • Temporary bonding processing method of sheet workpiece

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0026] The above-mentioned flaky workpiece generally refers to the processing of wafers, of course, it can also be applied to high-precision processing of other sheet products such as glass.

[0027] The invention provides a processing method for temporary bonding of sheet-shaped workpieces, which is characterized in that it comprises the following steps:

[0028] Step 1. Select a carrier plate 1, and set an isolation film 2 on the front of the carrier plate 1. The carrier plate 1 is made of a bendable material; the isolation film 2 is prepared on the carrier plate by spin coating or spray coating. on the front side of board 1.

[0029] Step 2, coating a layer of bonding glue 3 on the isolation film 2; the bonding glue 3 can be selected from commercially available chemical bonding materials, which can be dry bonding or wet bonding materials. ...

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Abstract

The invention discloses a temporary bonding processing method of a sheet workpiece. The method is characterized by comprising the following steps of (1) selecting a support plate and arranging an isolating membrane on the front surface of the support plate; (2) coating the isolating membrane with a layer of bonding glue; (3) attaching a to-be-processed workpiece to the bonding glue; (4) processing the workpiece with the support plate; (5) inverting the processed workpiece on a bearing part; (6) bending the support plate, making a random edge of the support plate form a warped edge and tearing at the warped edge until the support plate is stripped; and (7) bending the isolating membrane, making the random edge of the isolating membrane form the warped edge and tearing at the warped edge until the isolating membrane is stripped. By the temporary bonding processing method of the sheet workpiece, processing of the workpiece can be finished without special bonding or de-bonding equipment, so that the processing procedure is simple, the production efficiency is high, and the processing cost and the equipment investment cost are low.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a processing method for temporary bonding of sheet-shaped workpieces. Background technique [0002] Thin slice workpiece—taking wafer as an example, it needs to attach or bond the wafer to a thick carrier during the processing, so as to facilitate the subsequent processing of wafer thinning and other processes. However, existing wafers in the industry The best way is to bond the wafer and the carrier with the bonding glue first, then thin the wafer, and finally debond the processed wafer and the carrier. Of course, the remaining bonding glue needs to be processed. clean. In the above-mentioned existing process, no matter it is the bonding process or the debonding process, special equipment is required, such as the wafer vacuum bonding machine and bonding method with the patent application number 201410570392.5, and the wafer vacuum bonding machine with the patent applic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67132H01L21/67092H01L21/6836H01L2221/68327
Inventor 唐昊
Owner ZHEJIANG MICROTECH MATERIAL CO LTD
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