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Electronic product significant defect rapid excitation method

An electronic product, fast technology, applied in the direction of measuring electricity, measuring electrical variables, thermal analysis of materials, etc., can solve problems such as difficult product testing, and achieve the effect of robust design and wide range of environmental condition design

Inactive Publication Date: 2016-12-07
WUHU CEPREI INFORMATION IND TECH RES INST
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  • Description
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Problems solved by technology

The current test methods cannot meet the above requirements. Generally, each factor is tested separately, and it is difficult to comprehensively test the product after combining various factors.

Method used

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  • Electronic product significant defect rapid excitation method
  • Electronic product significant defect rapid excitation method
  • Electronic product significant defect rapid excitation method

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Embodiment Construction

[0022] refer to figure 1 , The rapid excitation method for major defects in electronic products of the present invention is mainly composed of temperature step test steps, rapid temperature change test steps, vibration step test steps and comprehensive environmental test steps.

[0023] Step 1 is a temperature step test, which is used to obtain the low temperature working limit, low temperature damage limit, high temperature working limit and high temperature damage limit. Generally, the starting temperature of the test is the ambient temperature +20°C ~ +30°C, and at least one power-on and power-off start-up and load test are performed at each step when the temperature is stable. If the product test is normal, the temperature change is performed in the range of 10°C , and so on until a functional failure occurs. After returning the temperature to normal temperature and stabilizing, perform a power-on start-up and a load test to observe whether its function is restored to dete...

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Abstract

The invention discloses an electronic product significant defect rapid excitation method. The method is mainly composed of a temperature stepping test step, a rapid temperature changing test step, a vibration stepping test step and a comprehensive environment test step. According to the invention, the method takes several key environment factors which influence product reliability into consideration. The several key environment factors include low temperature, high temperature, temperature rapid changing, vibration, etc. The method has wide range of environment condition design, allows strengthening of environment conditions, can rapidly excite possible hazards of a product and find product ultimate stress, and strengthen product design.

Description

technical field [0001] The invention relates to an electronic product testing technology, in particular to a method for rapidly stimulating major defects of an electronic product. Background technique [0002] To carry out a comprehensive product life and reliability test for electronic products, it is necessary to comprehensively consider various factors such as the ambient temperature, the speed of temperature changes, and the strength of vibration. Perform a rapid excitation. The current test methods cannot meet the above requirements. Generally, each factor is tested separately, and it is difficult to comprehensively test the product after integrating each factor. Contents of the invention [0003] In view of the above technical problems, the present invention provides a method for quickly stimulating major defects of electronic products, which can comprehensively test the reliability of products with various factors, and the test results are accurate, and can stimula...

Claims

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Application Information

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IPC IPC(8): G01R31/00G01M7/02G01M99/00G01N25/00G01N3/60
CPCG01R31/003G01M7/02G01M99/002G01N3/60G01N25/00G01N2203/0226G01N2203/0228
Inventor 李明峻侯卫国李骁刘永明李响
Owner WUHU CEPREI INFORMATION IND TECH RES INST
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