A regeneration and recovery method of an electrochemical acidic etching solution used for printed circuit boards
An acid etching solution, printed circuit board technology, applied in optics, electrolysis process, electrolysis components, etc., can solve the problems of post-processing of etching waste liquid, longer regeneration recovery cycle, low production efficiency, etc., to shorten the recovery cycle, reduce The effect of reducing the cost of chemicals and cleaning costs
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Embodiment 1
[0019] A method for regeneration and recovery of electrochemical acid etching solution for printed circuit boards, comprising the following steps:
[0020] 1) The acidic etching solution is introduced into the electrolytic cell. The electrolytic cell is divided into a cathode chamber and an anode chamber by an ion diaphragm. There are several cathode chambers, and each cathode chamber is connected in parallel with each other. The metal copper plate is used as the cathode in the cathode chamber, and the anode chamber The substrate to be etched is used as the anode, the etching solution used includes copper sulfate pentahydrate with a concentration of 50g / L, and sulfuric acid with a concentration of 10%, the etching reaction temperature is 25°C, and the etching current density used is 3A / dm 2 , wherein the size of the metal copper plate used is 75cm×350cm, and the ion separator used is an anion exchange membrane;
[0021] 2) After starting the etching, the acidic etching solutio...
Embodiment 2
[0026] A method for regeneration and recovery of electrochemical acid etching solution for printed circuit boards, comprising the following steps:
[0027] 1) The acidic etching solution is introduced into the electrolytic cell. The electrolytic cell is divided into a cathode chamber and an anode chamber by an ion diaphragm. There are several cathode chambers, and each cathode chamber is connected in parallel with each other. The metal copper plate is used as the cathode in the cathode chamber, and the anode chamber The substrate to be etched is used as the anode, the etching solution used includes copper sulfate pentahydrate with a concentration of 60g / L, sulfuric acid with a concentration of 10.5%, the etching reaction temperature is 30°C, and the etching current density used is 6.5A / dm 2 , wherein the size of the metal copper plate used is 75cm×350cm, and the ion separator used is an anion exchange membrane;
[0028] 2) After starting the etching, the acidic etching solutio...
Embodiment 3
[0030] A method for regeneration and recovery of electrochemical acid etching solution for printed circuit boards, comprising the following steps:
[0031] 1) The acidic etching solution is introduced into the electrolytic cell. The electrolytic cell is divided into a cathode chamber and an anode chamber by an ion diaphragm. There are several cathode chambers, and each cathode chamber is connected in parallel with each other. The metal copper plate is used as the cathode in the cathode chamber, and the anode chamber The substrate to be etched is used as the anode, the etching solution used includes copper sulfate pentahydrate with a concentration of 70g / L, sulfuric acid with a concentration of 11%, the etching reaction temperature is 35°C, and the etching current density used is 10A / dm 2 , wherein the size of the metal copper plate used is 75cm×350cm, and the ion separator used is an anion exchange membrane;
[0032] 2) After starting the etching, the acidic etching solution p...
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