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Printed circuit board and wireless communication device with printed circuit board

A technology for wireless communication devices and printed circuit boards, which is applied in the directions of printed circuits, printed circuit components, antenna supports/installation devices, etc., can solve the problems such as the influence of the volume of audio components, and achieves improved utilization and reduced parasitic capacitance. , Solve the effect of antenna interference

Active Publication Date: 2018-11-09
SHANGHAI TRANSSION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method also has certain defects. One is that in order to prevent the inductance connected in series from affecting the audio circuit, it needs to go through continuous testing and experiments to determine the appropriate inductance value. The other is that due to the relationship between the inductor current limit , the series inductance will affect the volume of the audio components to varying degrees

Method used

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  • Printed circuit board and wireless communication device with printed circuit board
  • Printed circuit board and wireless communication device with printed circuit board
  • Printed circuit board and wireless communication device with printed circuit board

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Embodiment 1

[0034] First, please refer to Figure 2 to Figure 4 The wireless communication device of this embodiment includes a printed circuit board 10, an antenna 11, an audio component 12, an audio circuit 13 and a parasitic capacitance reducing structure 14, and other components are not shown for convenience of description. Wherein, the printed circuit board 10 has a plurality of conductive layers 101 and a plurality of insulating layers 102 stacked vertically, and each insulating layer 102 is respectively disposed between each conductive layer 101 to isolate the lines of each conductive layer 101 . The audio component 12 is disposed on the top conductive layer, adjacent to the antenna, and has two electrical pins 121 , 122 directly connected to the audio circuit 13 . The electrical pins 121 and 122 are located on the top conductive layer, respectively forming two parallel plate capacitors with the next top conductive layer. The parasitic capacitance reducing structure 14 includes at...

Embodiment 2

[0036]The wireless communication device of this embodiment includes a printed circuit board 10 , an antenna 11 , an audio component 12 , an audio circuit 13 and a parasitic capacitance reducing structure 14 . Wherein, the printed circuit board 10 has a plurality of conductive layers 101 and a plurality of insulating layers 102 stacked vertically. The audio component 12 is located on the top conductive layer and adjacent to the antenna, and has two electrical pins 121 , 122 directly connected to the audio circuit 13 . The electrical pins 121, 122 are located on the top conductive layer. The parasitic capacitance reducing structure 14 includes two clear areas 14a and 14b disposed on the second top conductive layer and located below the electrical pins 121 and 122, and the two electrical pins 121 and 122 are completely located in the two clear areas respectively. Inside. The advantage of this is that the parallel plate capacitor is no longer formed between the electrical pin an...

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PUM

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Abstract

The invention discloses a wireless communication device, comprising a printed circuit board, an audio element, an audio circuit and a parasitic capacitance reducing structure, wherein the printed circuit board is provided with a plurality of conductive layers and a plurality of insulating layers arranged among the plurality of conductive layers respectively; the audio element and the audio circuit are arranged on the printed circuit board, and the audio element is arranged on the top conductive layer and provided with an electrical pin directly connected with the audio circuit; and the parasitic capacitance reducing structure is arranged on the printed circuit board to reduce the parasitic capacitance between the audio element and the conductive layer of the printed circuit board. By adopting the parasitic capacitance reducing structure, the working band of the audio element is improved so that the audio element works beyond the working frequency required by an antenna of the wireless communication device, and the problem that the audio element interferes with the antenna is solved.

Description

technical field [0001] The invention relates to a wireless communication device, in particular to an improvement of a printed circuit board structure of a wireless communication device. Background technique [0002] With the vigorous development of wireless communication technology and the miniaturization of mobile communication devices, the arrangement of various components in the wireless communication device is becoming more and more compact. Among them, audio components (including audio circuits, speakers, microphones, etc.) are often located adjacent to the built-in antenna, but these audio components often interfere with the antenna and thus affect wireless signal transmission. [0003] In order to solve the above problems, the current mainstream technical solution in the industry is to reduce the wiring area of ​​the antenna and avoid audio components. However, sacrificing the area of ​​the antenna will inevitably lead to a decrease in its performance. Another prior ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04B1/3827H01Q1/22H05K1/02
CPCH01Q1/22H04B1/3833H05K1/025
Inventor 阮勇
Owner SHANGHAI TRANSSION CO LTD
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