Plasma treating apparatus for vapor phase etching and cleaning

Abstract

Disclosed herein is a plasma treating apparatus for vapor phase etching and cleaning. The plasma treating apparatus for vapor phase etching and cleaning includes: a reactor body treating a substrate to be treated; a direct plasma generation region in the reactor body into which process gas is introduced to directly induce plasma; a plasma inducing assembly inducing the plasma to the direct plasma generation region; a substrate treatment region in the reactor body in which the plasma introduced from the direct plasma generation region and vaporized gas introduced from the outside of the reactor body are mixed with each other to form reactive species and the substrate to be treated is treated by the reactive species; and a dual gas distributing baffle provided between the direct plasma generation region and the substrate treatment region to distribute the plasma to the substrate treatment region and distribute the vaporized gas to a center region and a peripheral region of the substrate treatment region.

Description

technical field [0001] The present invention relates to a plasma device for gas-phase etching and cleaning, and in more detail, relates to a device for selectively cleaning by directly using highly reactive atoms or molecules to directly react with a thin film on the surface of a target substrate Plasma units for vapor phase etching and cleaning. Background technique [0002] Semiconductors are active electronic components with functions such as storage, amplification, and switching of electronic signals, and have high integration, high performance, and low power consumption. They are high value-added and leading digital informatization in the traction system industry and service industry Core components of the era. [0003] The semiconductor manufacturing process can be roughly divided into the front process (wafer processing process) and the back process (assembly process and inspection process), and the front process equipment accounts for about 75% of the market share. ...

AI Technical Summary

Problems solved by technology

For example, it is difficult to carry out the processing process in a vacuum atmosphere in a process chamber equipped with a vacuum chuck

Moreover, the above process is operated in one way, so when a problem occurs with the suction cup, it is necessary to stop the process operation or replace the suction cup, thereby reducing productivity and increasing maintenance costs

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