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Gapless contact type intelligent card chip module, intelligent card and manufacturing method for intelligent card chip module

A technology of smart card chips and chip modules, applied in the field of smart cards, to reduce short-circuit problems, improve anti-pollution capabilities, and have firm contacts

Active Publication Date: 2016-11-09
立联信(上海)微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a gapless contact smart card chip module, a smart card and a manufacturing method thereof, which can make the contacts firmer, make the module stronger and less prone to deformation, and reduce damage caused by the environment. short-circuit problem, and can improve anti-pollution ability

Method used

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  • Gapless contact type intelligent card chip module, intelligent card and manufacturing method for intelligent card chip module
  • Gapless contact type intelligent card chip module, intelligent card and manufacturing method for intelligent card chip module
  • Gapless contact type intelligent card chip module, intelligent card and manufacturing method for intelligent card chip module

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Embodiment Construction

[0023] The specific implementation of the gapless contact smart card chip module, the smart card and the manufacturing method thereof provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] see image 3 and Figure 4 , The chip module of the smart card with gapless contacts in the present invention includes a chip module body 31 and a plurality of contacts 3, and the contacts 3 are made of metal materials, such as copper. The structures of the chip module body 31 and the contacts 3 are existing structures in the art, and those skilled in the art can obtain them from the prior art.

[0025] The surface of the chip module body 31 has a dielectric layer 33 , and the dielectric layer 33 can be used to protect the chip module body 31 and fix the contacts 3 . The plurality of contacts 3 are embedded in the dielectric layer 33, that is, each of the contacts 3 is fixed by the dielectric layer 33, so that when the sm...

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Abstract

The invention provides a gapless contact type intelligent card chip module, an intelligent card and a manufacturing method for the intelligent card chip module. The gapless contact type intelligent card chip module comprises a chip module body and a plurality of contacts, wherein a dielectric layer is arranged on the surface of the chip module body; the contacts are embedded in the dielectric layer; and the two adjacent contacts are isolated by the dielectric layer. The intelligent card chip module has the advantages that the contacts are embedded in the dielectric layer, so that the contacts are firmer and unlikely to fall off, the module is firmer and unlikely to deform, the short-circuit problems caused by the environment are reduced, and the anti-pollution capability is improved.

Description

technical field [0001] The invention relates to the field of smart cards, in particular to a smart card chip module without gap contacts, a smart card and a manufacturing method thereof. Background technique [0002] With the continuous advancement of integrated circuit packaging technology, the integration level of integrated circuits is increasing day by day, the functions are becoming more and more abundant, and the requirements for product application fields are becoming more and more stringent, which requires integrated circuit packaging enterprises to develop new types of Package form to meet new requirements. For example, in the field of smart card packaging, the demand for smart cards in domestic and foreign markets is very large. At present, the smart card industry is developing towards the route of technological innovation. New technologies are constantly emerging, and new manufacturing technologies are also increasing. The technology is also continuously improved...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
CPCG06K19/07718G06K19/07743G06K19/07745
Inventor 高洪涛陆美华刘玉宝
Owner 立联信(上海)微电子科技有限公司
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