Barrier probe provided with solid dielectric film on probe point
A dielectric and conductive probe technology, applied in the field of potential barrier probes, can solve the problems of easy falling off, inability to be applied, weak adsorption force, etc.
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Embodiment 1
[0047] Barrier probe fabricated by depositing a solid dielectric film on the tip of a platinum-iridium alloy probe
[0048] First, cut out a sharp conductive tip from one end of a platinum-iridium alloy wire with a length of about 10 mm and a diameter of 0.15 mm with pliers or scissors to form a conductive probe 1, and then deposit a layer on the conductive tip of the conductive probe 1. A silicon dioxide solid dielectric film 2 with a thickness of about 10 nm is enough.
Embodiment 2
[0050] Barrier probe fabricated by depositing a solid dielectric film on a curved platinum-iridium alloy probe tip
[0051] In embodiment 1, it is sufficient to fold the platinum-iridium alloy wire into an angle of about 110° at a place about 2 mm behind the conductive tip of the conductive probe 1 . Since the probe of the scanning tunneling microscope does not need to vibrate, it is not necessary for the conductive probe to have excellent vibration stability.
Embodiment 3
[0053] Barrier probe made by depositing solid dielectric thin film at the tip of CAFM probe
[0054] First find a probe for CAFM, and deposit a layer of silicon dioxide solid dielectric film with a thickness of about 10 nm on the conductive tip of the probe.
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