Light emitting diode load board and manufacturing process thereof

Abstract

Disclosed are a light emitting diode load board and a manufacturing process thereof. The light emitting diode load board includes a substrate, a first dielectric layer, a second dielectric layer, a first conductive pad and a second conductive pad. The second dielectric layer includes a first structure part, a second structure part and a third structure part. The first dielectric layer is disposed on the substrate. The first structure part is disposed on the first dielectric layer and has a first sidewall. The second structure part is disposed on the first structure part and has a second sidewall. The third structure part is disposed on the second structure part and has N sidewalls. The second sidewall is more prominent than the first sidewall. The first sidewall, the second sidewall and the N sidewalls define the first etched part, and the part of the first dielectric layer is exposed from the first etched part. The first conductive pad is disposed in the first etched part. The second conductive is disposed on the second dielectric layer, covers part of the second dielectric and exposes the open of the first etched part.

Description

technical field [0001] The invention relates to a light-emitting diode carrier board and a manufacturing method thereof, in particular to a light-emitting diode carrier board with a calibration alignment structure and a manufacturing method thereof. Background technique [0002] Generally speaking, when a light-emitting diode is turned on to emit light, because all the electric energy cannot be used to emit light, a part of the electric energy will form heat energy. In practice, the luminous efficiency of light-emitting diodes will drop sharply due to the influence of high temperature, so more heat will be generated in addition to wasting electricity, which will further increase the temperature and cause a vicious circle. Therefore, the light-emitting diodes need to be carried on a carrier board with good heat dissipation performance, so as to avoid wasting power and shortening the lifespan. [0003] In addition, for the convenience of manufacturing, the general LED carrier...

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Problems solved by technology

[0004] In view of the above, the purpose of the present invention is to disclose a light emitting diode carrier and its manufacturing method, so as to improve the thermal conductivity of the light emitting diode carrier when manufacturing the light emitting diode carrier, and solve the alignment between the light emitting diode and the carrier Contiguous question

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