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Film thickness sample, inspection sample and inspection method for calibrating ellipsometer

An inspection method and ellipsometer technology, which is applied in the field of ellipsometer calibration, can solve problems such as deviations in results, and achieve the effects of consistent thickness, improved accuracy, and consistent regions

Active Publication Date: 2019-04-16
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Application Information

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Problems solved by technology

To obtain parameters such as the refractive index and thickness of the film, a model must be established. The measurement model is the core technology of the ellipsometer. For technical protection, ellipsometer manufacturers have their own measurement models, which leads to the use of different manufacturers. When the instrument measures the thickness of the same film, the result will be biased

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  • Film thickness sample, inspection sample and inspection method for calibrating ellipsometer

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, any modifications, equivalent replacements and improvements within the spirit and principles of the present invention made by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0026] The film thickness samples for calibrating the ellipsometer are a series of film thickness samples with different film thicknesses. Silicon wafer 1 is selected as the substrate material, and each sample is a silicon wafer 1 with a thin film attached. The thin film is divided into two types, namely Silicon film and silicon nitride film; including the two most commonly used m...

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Abstract

The invention discloses a calibration ellipsometer film thickness sample, a test sample and a test method, and relates to the technical field of ellipsometer calibration, comprising a plurality of groups of silicon wafers attached by silica or silicon nitride. The thickness of the silicon dioxide films is less than or equal to 1000nm; the thickness of the silicon nitride films is less than or equal to 200nm. This means the coverage of application areas of silicon dioxide films and silicon nitride films in current semiconductor technology. The silicon wafers are further provided with calibration graphs, and the areas surrounded by the calibration graphs are calibration areas, or rather, the measuring areas in ellipsometer calibration. The calibration areas are located in the central parts of the silicon wafers. For ellipsometer calibration at each time, the areas and the thickness are consistent, so as to ensure the accuracy of calibration. The invention also discloses a test sample and a test method for the film thickness of ellipsometer calibration, which can perform tests on the film thickness of ellipsometer calibration and test whether the test sample thickness can calibrate the ellipsometer or not.

Description

technical field [0001] The invention relates to the technical field of ellipsometer calibration, in particular to a film thickness sample for calibrating an ellipsometer, a test sample and a test method thereof. Background technique [0002] In the semiconductor industry, thermal oxide films (SiO 2 thin film), dielectric film (Si 3 N 4 Thin films) are used to realize various functions of the device. Both thermal oxide film and dielectric film are transparent films, film thickness is an important parameter, and its measurement accuracy will directly affect the performance index of the device. Therefore, the accurate and rapid measurement and control of various film thickness parameters is to ensure that the device An important means to improve quality and improve production efficiency. Ellipsometer is an instrument used to measure and monitor film thickness in the production process of microelectronic chips. It is mainly used to solve the problem of measuring the thicknes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/06G01N21/21G01N21/41
CPCG01B11/06G01N21/21G01N21/211G01N21/41G01N21/4133G01N2021/4126
Inventor 李锁印
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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