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Method of eutectic soldering of chip in big pad

A technology of eutectic welding and large spacers, which is applied in welding equipment, auxiliary devices, electrical components, etc., can solve the problems of easy dislocation between chips and large spacers, and achieve the effects of wide application range, strong feasibility and low cost

Active Publication Date: 2016-10-12
THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention proposes a chip eutectic welding method in a large spacer, which solves the problem that the chip and the large spacer are easily dislocated during welding in the prior art

Method used

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  • Method of eutectic soldering of chip in big pad
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  • Method of eutectic soldering of chip in big pad

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] The purpose of the present invention is to provide a method for eutectic welding of chips in a large spacer, which can provide positioning for the chip when vacuum eutectic welding of GaAs-based chips, and solve the problem that the size of the spacer is larger than the chip when the current vacuum eutectic welding chip is used. Many (generally above 1mm), the problem that the chip cannot be positioned.

[0034] Such as figure 1 As shown, the chip eute...

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Abstract

The present invention provides a method of eutectic soldering of a chip in a big pad. The method includes the following steps: step (a), determining the size of an L-shaped ceramic location clamp according to the size of the pad; step (b), determining the size of a ceramic locating pressing block according to the sizes of the pad and the chip; step (c), cutting the L-shaped ceramic locating clamp in the corresponding size by using a laser; step (d), cutting the ceramic locating pressing block in the corresponding size by using a grinding wheel cutting machine; step (e), during the process for locating the chip, first fixing the pad by using the L-shaped ceramic locating clamp, then putting the ceramic locating pressing block into the pad, and finally putting a soldering lug and the chip onto the pad; and step (f), after fixing the chip by the locating clamp, putting the chip into a vacuum eutectic furnace to perform eutectic soldering by using a soldering fixture. The method effectively solves a problem of dislocation between the chip and the pad, and the method is easy, and has a low cost and a high feasibility.

Description

technical field [0001] The invention relates to the technical field of microwave and millimeter wave micro-assembly, in particular to a chip eutectic welding method in a large spacer. Background technique [0002] Vacuum eutectic welding technology is a method that uses the characteristics of eutectic alloys to realize the welding of chips and substrates, substrates and shells, and cover plates and shells. Since eutectic solder pads have better thermal conductivity and electrical conductivity than conductive adhesives, and with the increase in the power of chip integrated products, more and more chips need to use eutectic soldering instead of conductive adhesive bonding to achieve interconnection. [0003] Vacuum eutectic welding belongs to the thermocompression welding method. Therefore, in order to obtain the eutectic welding effect of high electrical conductivity, high thermal conductivity and low void rate in GaAs-based chips, it is necessary to provide a certain pressur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50B23K1/008B23K3/08
CPCH01L21/50B23K1/008B23K3/08
Inventor 宋志明李红伟吴红
Owner THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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