Preparation method for graphene/epoxy resin composite material

A technology of epoxy resin and composite materials, applied in the field of resin materials, which can solve the problems of unsatisfactory performance of graphene epoxy resin composite materials, limiting the promotion and development of composite materials, and failing to meet application requirements.

Active Publication Date: 2016-10-12
SHANDONG OBO NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still many problems in the composite process in the existing actual production process, which leads to the unsatisfactory performance of the graphene epoxy resin composite material, which cannot meet the application requirements in various fields, and limits the promotion and development of composite materials.

Method used

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Experimental program
Comparison scheme
Effect test

preparation example Construction

[0031] The invention provides a kind of preparation method of graphene / epoxy resin composite material, comprises the following steps:

[0032] A) after mixing the graphene microchips with an organic solvent, a dispersion is obtained;

[0033] B) after mixing the dispersion obtained in the above steps with the epoxy resin again, a mixed solution is obtained;

[0034] C) After the mixed solution obtained in the above steps is subjected to vacuum rotary evaporation, the mixture is obtained;

[0035] D) adding a curing agent to the mixture obtained in the above steps for reconciliation, and then curing to obtain a graphene / epoxy resin composite material.

[0036] In the invention, firstly, the dispersion liquid is obtained after mixing the graphene microchips and the organic solvent. The present invention does not have special limitation to described graphene microchip, can get final product with the graphene microchip well known to those skilled in the art, can be prepared acco...

Embodiment 1

[0047] 1) Add 0.01g of graphene powder into 50ml of acetone, ultrasonically disperse in an ice-water bath for 1 hour with an ultrasonic power of 0.8kW, to form a uniform black dispersion.

[0048] 2) Add 100g of epoxy resin E-51 to the graphene acetone solution obtained in step 1), and ultrasonically disperse in an ice-water bath for 1 hour, with an ultrasonic power of 0.8kW. / min speed, vacuum rotary evaporation to remove the solvent.

[0049] 3) Add 50 g of polyamide 300 to the ultrasonically dispersed mixture obtained in step 2), and stir at a high speed for 30 minutes at a speed of 1500 r / min. Place in a vacuum oven, remove air bubbles at room temperature and 0.05 MPa until no bubbles escape from the mixture.

[0050] 4) Slowly pour the mixture obtained in step 3) into a mold, which is coated with a release agent and preheated at 70°C. Put it into an oven at 60° C. for 3 hours, then cool to room temperature, and obtain a graphene / epoxy resin composite material after demo...

Embodiment 2

[0053] 1) Add 0.05g of graphene powder into 50ml of acetone, ultrasonically disperse in an ice-water bath for 1 hour with an ultrasonic power of 0.8kW, to form a uniform black dispersion.

[0054] 2) Add 100g of epoxy resin E-51 to the graphene acetone solution obtained in step 1), and ultrasonically disperse in an ice-water bath for 1 hour, with an ultrasonic power of 0.8kW. Min speed, vacuum rotary evaporation to remove the solvent.

[0055] 3) Add 50 g of polyamide 300 to the ultrasonically dispersed mixture obtained in step 2), and stir at a high speed for 30 minutes at a speed of 1500 r / min. Place in a vacuum oven, remove air bubbles at room temperature and 0.05 MPa until no bubbles escape from the mixture.

[0056] 4) Slowly pour the mixture obtained in step 3) into a mold, which is coated with a release agent and preheated at 70°C. Put it into an oven at 60° C. for 3 hours, then cool to room temperature, and obtain a graphene / epoxy resin composite material after demou...

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Abstract

The invention provides a preparation method for a graphene / epoxy resin composite material. The preparation method comprises the following steps that after graphene microsheets and an organic solvent are mixed, dispersion liquid is obtained; then, the dispersion liquid obtained in the first step is mixed with epoxy resin again, and mixed liquid is obtained; the mixed liquid obtained in the second step is subjected to vacuum rotary steaming, and a mixture is obtained; finally, a curing agent is added into the mixture obtained in the third step to be blended, and after resolidification, the graphene / epoxy resin composite material is obtained. For the problem that the mechanical performance of a graphene modified epoxy resin composition material is poor, a large number of experiments and a large deal of creative exploration are carried out on a plurality of steps and parameters in the preparation process; from the perspective of the addition proportion, the evaporation mode and the like, the vacuum rotary steaming mode is adopted, the removal efficiency of the solvent is improved, residues are reduced to the maximum extent, and the performance of the graphene modified epoxy resin is further improved through optimization of the whole operation steps.

Description

technical field [0001] The invention belongs to the technical field of resin materials, and in particular relates to a preparation method of a graphene / epoxy resin composite material. Background technique [0002] Epoxy resin generally refers to organic compounds containing two or more epoxy groups in the molecule. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain. The epoxy groups can Located at the end of the molecular chain, in the middle or in a ring structure. Since the active epoxy groups in the molecular structure can be cross-linked with various types of curing agents to form an insoluble three-dimensional network structure, all polymer compounds containing epoxy groups in the molecular structure are collectively called epoxy resins. The cured epoxy resin has good physical and chemical properties, it has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, small de...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/04C08J3/09
CPCC08K3/04C08K7/00C08K9/02C08L63/00C08J3/09C08J2363/00
Inventor 刘海波张在忠赵新新
Owner SHANDONG OBO NEW MATERIAL CO LTD
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