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A kind of preparation method of graphene/epoxy resin composite material

A technology of epoxy resin and composite materials, which is applied in the field of resin materials, can solve the problems that the properties of graphene epoxy resin composite materials are not ideal, cannot meet the application requirements, limit the promotion and development of composite materials, etc.

Active Publication Date: 2019-04-19
SHANDONG OBO NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still many problems in the composite process in the existing actual production process, which leads to the unsatisfactory performance of the graphene epoxy resin composite material, which cannot meet the application requirements in various fields, and limits the promotion and development of composite materials.

Method used

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Examples

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Comparison scheme
Effect test

preparation example Construction

[0031] The invention provides a kind of preparation method of graphene / epoxy resin composite material, comprises the following steps:

[0032] A) after mixing the graphene microchips with an organic solvent, a dispersion is obtained;

[0033] B) after mixing the dispersion obtained in the above steps with the epoxy resin again, a mixed solution is obtained;

[0034] C) After the mixed solution obtained in the above steps is subjected to vacuum rotary evaporation, the mixture is obtained;

[0035] D) adding a curing agent to the mixture obtained in the above steps for reconciliation, and then curing to obtain a graphene / epoxy resin composite material.

[0036] In the invention, firstly, the dispersion liquid is obtained after mixing the graphene microchips and the organic solvent. The present invention does not have special limitation to described graphene microchip, can get final product with the graphene microchip well known to those skilled in the art, can be prepared acco...

Embodiment 1

[0047] 1) Add 0.01g of graphene powder into 50ml of acetone, ultrasonically disperse in an ice-water bath for 1 hour with an ultrasonic power of 0.8kW, to form a uniform black dispersion.

[0048] 2) Add 100g of epoxy resin E-51 to the graphene acetone solution obtained in step 1), and ultrasonically disperse in an ice-water bath for 1 hour, with an ultrasonic power of 0.8kW. / min speed, vacuum rotary evaporation to remove the solvent.

[0049] 3) Add 50 g of polyamide 300 to the ultrasonically dispersed mixture obtained in step 2), and stir at a high speed for 30 minutes at a speed of 1500 r / min. Place in a vacuum oven, remove air bubbles at room temperature and 0.05 MPa until no bubbles escape from the mixture.

[0050] 4) Slowly pour the mixture obtained in step 3) into a mold, which is coated with a release agent and preheated at 70°C. Put it into an oven at 60° C. for 3 hours, then cool to room temperature, and obtain a graphene / epoxy resin composite material after demo...

Embodiment 2

[0053] 1) Add 0.05g of graphene powder into 50ml of acetone, ultrasonically disperse in an ice-water bath for 1 hour with an ultrasonic power of 0.8kW, to form a uniform black dispersion.

[0054] 2) Add 100g of epoxy resin E-51 to the graphene acetone solution obtained in step 1), and ultrasonically disperse in an ice-water bath for 1 hour, with an ultrasonic power of 0.8kW. min speed, the solvent was removed by rotary evaporation under vacuum.

[0055] 3) Add 50 g of polyamide 300 to the ultrasonically dispersed mixture obtained in step 2), and stir at a high speed for 30 minutes at a speed of 1500 r / min. Place in a vacuum oven, remove air bubbles at room temperature and 0.05 MPa until no bubbles escape from the mixture.

[0056] 4) Slowly pour the mixture obtained in step 3) into a mold, which is coated with a release agent and preheated at 70°C. Put it into an oven at 60° C. for 3 hours, then cool to room temperature, and obtain a graphene / epoxy resin composite material ...

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Abstract

The invention provides a kind of preparation method of graphene / epoxy resin composite material, comprises the following steps, at first after graphene microplate is mixed with organic solvent, obtains dispersion liquid; Then the dispersion liquid obtained in above-mentioned steps is mixed with epoxy resin After mixing again, a mixed solution is obtained; the mixed solution obtained in the above steps is subjected to vacuum rotary evaporation to obtain a mixture; finally, a curing agent is added to the mixture obtained in the above steps for reconciliation, and the graphene / epoxy resin composite material is obtained after recuring. Aiming at the problem of poor mechanical properties of graphene-modified epoxy resin composite materials, the present invention conducts a large number of experiments and creative explorations between multiple steps and parameters in the preparation process, starting from the addition ratio and evaporation methods, etc., using The vacuum rotary evaporation method improves the solvent removal efficiency, minimizes the residue, and combines with the optimization of the overall operation steps to further improve the performance of the graphene-modified epoxy resin.

Description

technical field [0001] The invention belongs to the technical field of resin materials, and in particular relates to a preparation method of a graphene / epoxy resin composite material. Background technique [0002] Epoxy resin generally refers to organic compounds containing two or more epoxy groups in the molecule. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain. The epoxy groups can Located at the end of the molecular chain, in the middle or in a ring structure. Since the active epoxy groups in the molecular structure can be cross-linked with various types of curing agents to form an insoluble three-dimensional network structure, all polymer compounds containing epoxy groups in the molecular structure are collectively called epoxy resins. The cured epoxy resin has good physical and chemical properties, it has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, small de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/04C08J3/09
CPCC08K3/04C08K7/00C08K9/02C08L63/00
Inventor 刘海波张在忠赵新新
Owner SHANDONG OBO NEW MATERIAL CO LTD
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