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High-strength ceramic substrate and preparation method and production line thereof

A ceramic substrate, high-strength technology, used in ceramic molding machines, ceramic molding workshops, manufacturing tools, etc., can solve problems such as low flexural strength, and achieve the effects of high flexural strength, uniform grains and uniform structure

Inactive Publication Date: 2016-08-24
SINOCERAM TECH (ZHENGZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in some fields, in addition to high thermal conductivity, alumina ceramic substrates are also required to have high mechanical properties, especially in thin plates, alumina ceramic substrates are required to have high flexural strength, but the thicker the The lower the bending strength of the thin alumina ceramic substrate, it is urgent to develop a high-strength, high-thermal conductivity ceramic substrate

Method used

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  • High-strength ceramic substrate and preparation method and production line thereof
  • High-strength ceramic substrate and preparation method and production line thereof
  • High-strength ceramic substrate and preparation method and production line thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033] High-strength ceramic substrate, made of ceramic powder, binder, dispersant, plasticizer and solvent, the weight ratio of the ceramic powder, binder, dispersant, plasticizer and solvent is 1:0.08 : 0.01: 0.03: 0.5; wherein the ceramic powder is composed of alumina powder and zirconia powder, and the content of zirconia powder in the ceramic powder is 3wt%.

[0034] The particle size of alumina in the ceramic powder is 0.5 μm, the particle size of zirconia is 0.1 μm, and the specific surface area of ​​the ceramic powder is 5000 m 2 / kg; the solvent is composed of absolute ethanol and butanone, and the weight ratio of absolute ethanol and butanone is 1:1.

[0035] A method for preparing a high-strength ceramic substrate, comprising the following steps:

[0036] (1) Add ceramic powder, dispersant and part of solvent to ball mill 2 after ball milling for 8 hours, add the mixture of binder, plasticizer and the solvent of the remaining part mixed uniformly in premixer 1, con...

Embodiment 2

[0040] High-strength ceramic substrate, made of ceramic powder, binder, dispersant, plasticizer and solvent, the weight ratio of the ceramic powder, binder, dispersant, plasticizer and solvent is 1:0.15 : 0.03: 0.06: 0.8; wherein the ceramic powder is composed of alumina powder and zirconia powder, and the content of zirconia powder in the ceramic powder is 30wt%.

[0041] The particle size of alumina in the ceramic powder is 2.0 μm, the particle size of zirconia is 0.5 μm, and the specific surface area of ​​the ceramic powder is 3000 m 2 / kg; the solvent is composed of absolute ethanol and butanone, and the weight ratio of absolute ethanol and butanone is 1: 1.5.

[0042] A method for preparing a high-strength ceramic substrate, comprising the following steps:

[0043] (1) After adding ceramic powder, dispersant and part of solvent to ball mill 2 for ball milling for 10 hours, add the mixture of binder, plasticizer and the solvent of the remaining part mixed uniformly in pre...

Embodiment 3

[0047] High-strength ceramic substrate, made of ceramic powder, binder, dispersant, plasticizer and solvent, the weight ratio of the ceramic powder, binder, dispersant, plasticizer and solvent is 1:0.1 : 0.02: 0.05: 0.6; wherein the ceramic powder is composed of alumina powder and zirconia powder, and the content of zirconia powder in the ceramic powder is 10wt%.

[0048] The particle size of alumina in the ceramic powder is 1.0 μm, the particle size of zirconia is 0.3 μm, and the specific surface area of ​​the ceramic powder is 4000 m 2 / kg; the solvent is composed of absolute ethanol and butanone, and the weight ratio of absolute ethanol and butanone is 1: 1.2.

[0049] A method for preparing a high-strength ceramic substrate, comprising the following steps:

[0050] (1) Add the ceramic powder, dispersant and part of the solvent into the ball mill 2 for ball milling for 9 hours, then add the mixture of the binder, plasticizer and the remaining part of the solvent mixed unif...

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Abstract

The invention discloses a high-strength ceramic substrate. The high-strength ceramic substrate is composed of ceramic powder, binders, dispersing agents, plasticizers and solvents, wherein the weight ratio of the ceramic powder to the binders to the dispersing agents to the plasticizers and to the solvents is 1 to 0.08-0.15 to 0.01-0.03 to 0.03-0.06 to 0.5-0.8; the ceramic powder is composed of alumina powder and zirconium oxide powder, and the content of the zirconium oxide powder accounts for 3-30% in the ceramic powder by weight. The invention further discloses a preparation method and a production line of the ceramic substrate. The ceramic substrate is excellent in mechanical strength, high in bending strength, good in heat conduction characteristic, high in stability at high temperature and capable of being machined into various complex shapes. The preparation method is simple, the number of processes is small, and the obtained substrate is uniform and compact in structure, high in bending strength, smooth in surface and low in cost. The production line is simple, small in occupied space and suitable for industrial application.

Description

technical field [0001] The invention belongs to the technical field of ceramic substrates, and in particular relates to a high-strength ceramic substrate, a preparation method and a production line thereof. Background technique [0002] In high-power, high-density packaging, the heat generated by electronic components and chips during operation is mainly dissipated to the environment through the ceramic substrate, so the ceramic substrate plays an important role in the heat dissipation process. Al 2 o 3 The thermal conductivity of ceramics is relatively low, and it must be forced to dissipate heat when operating high-power, high-density packaged devices to meet the requirements. BeO ceramics have the best thermal conductivity, but they are basically eliminated due to environmental protection issues. The bonding of SiC ceramics is unstable after metallization, and when used as an insulating substrate, it will cause changes in thermal conductivity and dielectric constant. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B1/29B28B15/00C04B35/10C04B35/622
CPCC04B35/10C04B35/622B28B1/29B28B15/00C04B2235/5445C04B2235/5436C04B2235/549C04B2235/96C04B2235/77C04B2235/3224
Inventor 吴崇隽魏帅鹏蔡斌斌
Owner SINOCERAM TECH (ZHENGZHOU) CO LTD
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