Preparation process for graphite heat conduction and dissipation patch

Abstract

The invention relates to a preparation process for a graphite heat conduction and dissipation patch. A first coating layer of the graphite heat conduction and dissipation patch is formed from a graphite modifier applied onto the upper surface of a polyimide thin film, and the graphite modifier comprises the following constituents by weight percent: benzophenonetetracarboxylic dianhydride, pyromellitic dinahydride anhydride, diaminodiphenylmethane, dimethylformamide, N-methyl-2-pyrrolidone, ethylene glycol, polydimethylsiloxane and dibutyl phthalate. The preparation process comprises the following steps of applying the graphite modifier onto the upper surface of the polyimide thin film to obtain the processed polyimide thin film; rising the temperature of a carbonization film to be 2,350-2,450 DEG C, carrying out heat preservation, rising the temperature again to be 2,850-2,950 DEG C, and cooling the carbonization film to obtain a graphite film mainly sintered. By the preparation process, local heating is prevented, the uniformity of heat conduction performance is achieved, meanwhile, the stability and the reliability of heat dissipation performance of a product are improved, and the product cost is greatly reduced.

Description

Technical field [0001] The invention relates to a manufacturing process for a graphite heat-conducting heat dissipation patch, and belongs to the technical field of adhesive tapes. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as notebook computers, mobile phones, tablet computers, etc.) have become increasingly ultra-thin and light. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easily discharged , Easy to accumulate quickly to form high temperature. On the other hand, high temperature will reduce the performance, reliability and service life of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient thermally conductive and...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness

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