Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Loudspeaker of headset

A loudspeaker and earphone technology, applied in the field of loudspeakers, can solve the problems of distortion, limited bandwidth of loudspeaker playback, split vibration of loudspeaker diaphragm, etc., and achieve the effects of increasing width, increasing stiffness, and reducing distortion.

Inactive Publication Date: 2016-08-10
QINGDAO GOERTEK
View PDF8 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above problems, the present invention provides an earphone loudspeaker to solve the problem that the diaphragm of the existing loudspeaker is prone to split vibration in the high frequency band, easily causing distortion, and the playback frequency bandwidth of the loudspeaker is limited.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Loudspeaker of headset
  • Loudspeaker of headset

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] figure 2 The cross-sectional view of the earphone speaker provided by the embodiment of the present invention, the earphone speaker of this embodiment is especially suitable for in-ear earphones.

[0025] Such as figure 2 as shown, figure 2 The earphone loudspeaker in includes: support 2 and the magnetic circuit system and vibration system accommodated inside the support 2, the magnetic circuit system is the ring magnetic circuit formed by T iron 6, ring magnet 5 and ring washer 3, wherein the ring washer 3 and T iron 6 forms a ring-shaped magnetic circuit gap;

[0026] Specifically, refer to figure 2 As shown, the T iron 6 includes a circular bottom plate and a column core perpendicular to the center of the circular bot...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed in the invention is a loudspeaker of a headset. The loudspeaker comprises a support frame, a magnetic circuit system, and a vibrating system, wherein the magnetic circuit system and the vibrating system are accommodated into the support frame. The magnetic circuit system is a ring-shaped magnetic circuit formed by a T iron, an annular magnet and an annular washer; and the annular washer and the T iron form an annular magnetic circuit gap. The vibrating system consists of a vibration membrane, a voice coil, and a gasket; the voice coil is attached to the vibration membrane and is suspended in the annular magnetic circuit gap; and the gasket is arranged on the upper end surface of the T iron. The vibration membrane is arranged above the magnetic circuit system and the edge of the vibration membrane is fixed on the support; and the middle part of the vibration membrane is fixed on the gasket. According to the technical scheme, because the e middle part of the vibration membrane is fixed on the gasket above the T iron, the strength of the root part of the vibration membrane is enhanced, so that the upper limit of the high-frequency replaying and the width of the relaying frequency band of the loudspeaker of the headset are improved and distortion caused by segmentation vibration is reduced.

Description

technical field [0001] The invention relates to the technical field of loudspeakers, in particular to an earphone loudspeaker. Background technique [0002] The structure of common headphone speakers is as follows: figure 1 As shown, the bracket 2' supports the entire system of the speaker, the ring magnet 5', the ring washer 3' and the T iron 6' form a ring magnetic circuit, and the voice coil 4' is pasted on the diaphragm 1' and suspended on the ring washer 3' and the magnetic gap formed by T iron 6'. After electrification, the voice coil 4' is stressed in the magnetic field, which drives the diaphragm 1' to vibrate and produce sound. [0003] figure 1 The structure of the earphone speaker has at least the following problems: [0004] (1) The loudspeaker diaphragm is prone to split vibration in the high frequency band, which is easy to cause distortion; [0005] (2) The width of the speaker playback frequency band is limited. Contents of the invention [0006] In v...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04R9/06H04R9/02
CPCH04R9/06H04R9/025H04R2209/022
Inventor 王书晓张波郭在康张杰刘悦文
Owner QINGDAO GOERTEK
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com