A photoacoustic composite three-dimensional micro-nano imaging detection system and method

Abstract

The invention discloses a photoacoustic composite three-dimensional micro-nano imaging detection system. The system comprises an optical holographic optical path, a computer, a microscope, a piezoelectric crystal plate used for containing a solid sample and a power amplifier used for driving the piezoelectric crystal plate to vibrate, the computer is connected with a synchronous controller and a digital camera, and the synchronous controller is connected with a waveform generator and a pulsed laser; the optical holographic optical path comprises an object light optical path body, a reference light optical path body and a first beam splitting cubic mirror, the object light optical path body comprises a second beam splitting cubic mirror, a first beam expanding mirror and a first reflecting mirror, and the reference light optical path body comprises a third beam splitting mirror, a second reflecting mirror and a second expanding mirror. The invention further discloses a photoacoustic composite three-dimensional micro-nano imaging detection method. The photoacoustic composite three-dimensional micro-nano imaging detection system and method are reasonable in design, convenient to achieve, capable of being suitable for defect detection of the solid samples with different thicknesses, high in detection speed, detection precision and reliability, capable of truly achieving nondestructive detection, high in practicability, wide in application range and convenient to use and popularize.

Description

technical field [0001] The invention belongs to the technical field of nondestructive testing, and in particular relates to a photoacoustic composite three-dimensional micro-nano imaging detection system and method. Background technique [0002] With the rapid development of semiconductor manufacturing technology and micro-nano manufacturing technology, micro devices and micro systems (such as ultra-highly integrated chips, micro sensors, etc.) field. However, the reliability testing and quality control technology for these miniature products lags far behind the development of manufacturing technology. The scanning acoustic microscopy (SAM) microscopic imaging technology realizes the tomographic detection of internal defects of the sample through the point-by-point scanning of the high-frequency ultrasonic focusing probe. However, the lateral resolution of a 300MHz ultrasonic focusing probe can only be It can reach more than ten microns, and, for such a high-frequency soun...

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Problems solved by technology

However, the reliability testing and quality control technology for these miniature products lags far behind the development of manufacturing technology

The scanning acoustic microscopy (SAM) microscopic imaging technology realizes the tomographic detection of internal defects of the sample through the point-by-point scanning of the high-frequency ultrasonic focusing probe. However, the lateral resolution of a 300MHz ultrasonic focusing probe can only be Reaches more than ten microns, and, for such a high-frequency sound wave, its penetrating ability is very poor due to dispersion attenuation, and only very thin samples can be detected

The latest three-dimensional X-ray CT (3D X-Ray CT) can achieve a resolution of 50nm, but the test sample must be cut into small units, which destroys the integrity of the microelectronic packaging sample, and the imaging efficiency is extremely low

Although the resolution of atomic force microscopy and related technologies can reach the nanometer level, they can only scan very small sample areas (several micrometers × several micrometers), and the imaging speed is very slow, and they have no penetrating power, so they cannot scan the inside of the microelectronic package. defect detection

Traditional detection technology can no longer adapt to the development of these advanced manufacturing technologies. The existing nondestructive testing technology is facing serious challenges. Advanced nondestructive evaluation technology with higher volume resolution is needed to evaluate the reliability of micro-integrated systems.

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