Silicon ingot cutting system and silicon ingot cutting method

Abstract

The invention provides a silicon ingot truncation system and a silicon ingot truncation method. The silicon ingot truncation system comprises silicon ingot truncation equipment and silicon ingot storage equipment, wherein the silicon ingot truncation equipment is used for performing truncation on silicon ingots to form silicon cubes; and the silicon ingot storage equipment is located at the front end of the silicon ingot truncation equipment and is used for storing the silicon ingots and conveying the stored silicon ingots to the silicon ingot truncation equipment. Compared with the prior art, the silicon ingot truncation system and the silicon ingot truncation method have the advantages that the to-be-truncated silicon ingots can be well collectively stored in the silicon ingot storage equipment; during truncation, the silicon ingots stored in the silicon ingot storage equipment are conveyed to the silicon ingot truncation equipment for truncation to form the silicon cubes; the storing and conveying of the silicon ingots are convenient; and the truncation efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of workpiece processing, in particular to a silicon ingot cutting system and a silicon ingot cutting method. Background technique [0002] Wire cutting technology is a relatively advanced square extraction processing technology in the world at present. Its principle is to rub the workpiece (such as silicon ingot, sapphire, or other semiconductor hard and brittle materials) through high-speed moving diamond wire to cut out a square ingot. , so as to achieve the purpose of cutting. During the cutting process of the workpiece, the diamond wire is guided by the guide wheel to form a wire net on the main wire roller, and the workpiece to be processed is fed by the rise and fall of the worktable. Under the action of the pressure pump, the assembly The cooling water automatic spraying device on the equipment sprays the cooling water to the cutting part of the diamond wire and the workpiece, and the reciprocating m...

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a silicon ingot cutting system and a silicon ingot cutting method, which are used to solve the problems of low efficiency of silicon ingot cutting, low storage and handling efficiency of silicon ingots to be processed and problems in the prior art. Big safety hazards and other issues

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