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LED chip assembly structure and assembly method of smart label connector

A technology of LED chips and smart labels, which is applied to the parts of the connection device, the assembly/disassembly of the contacts, the protective grounding/shielding device of the connection parts, etc., which can solve the problems of unfavorable market competitiveness, complicated assembly process, and difficult disassembly and assembly, etc. problems, to achieve the effect of ensuring stability and communication quality, easy assembly, simplified complexity and difficulty of assembly

Active Publication Date: 2016-07-27
DONGGUAN YUQIU ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The electronic label is connected to the control line through the label connector. Specifically, the label connector is provided with a control line interface for connecting the control line and an electronic label interface for connecting the electronic label. The label connector is provided with an LED for display. The LED is fixed by welding the built-in wire of the label connector and the terminal in the control line interface. Since the LED of the label connector needs to emit light from the side, the assembly method of using the robot to pick up the LED and assemble it by lifting is not suitable for the assembly of the label connector. LED, that is to say, the assembly of the above-mentioned LED and the welding of the wires are all done manually. The entire assembly process is relatively complicated, the efficiency is low, and it is difficult to disassemble and assemble, which is not conducive to improving the market competitiveness of the product.

Method used

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  • LED chip assembly structure and assembly method of smart label connector
  • LED chip assembly structure and assembly method of smart label connector
  • LED chip assembly structure and assembly method of smart label connector

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Experimental program
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Embodiment 2

[0081] combine Figure 13 As mentioned above, the difference between the second embodiment and the first embodiment above is that the first bending part 3212 in the first elastic contact arm 321 in the second embodiment is located at the lower end of the first raised part 3211, that is to say, The first bending part of the first elastic contact arm in the above-mentioned embodiment 1 faces upwards, while the first bending part of the first elastic contact arm of the second embodiment faces downwards, which has the same technical effect. This will not repeat them one by one.

Embodiment 3

[0083] combine Figure 14 As mentioned above, the difference between the second embodiment and the first embodiment is that the first elastic contact arm 321 includes a first raised portion 3211 formed by bending, and the first raised portion 3211 is in contact with the outer surface of the LED chip 2 The shape and structure of the elastic connecting arm 331 in the ground terminal 33 are the same as the shape and structure of the first elastic contact arm 321 . That is to say, the first elastic contact arm 321 and the elastic lead arm 331 of the ground terminal are respectively clamped on the two sides of the LED chip 2, and are elastically connected to the positive and negative electrodes 21 and 22 on the two sides of the LED chip 2 respectively. contact and form a non-soldering conduction.

[0084] Except for the above, the other structures of the third embodiment are the same as those of the first embodiment above, and have basically the same technical effects, and will no...

Embodiment 4

[0086] combine Figure 15 As mentioned above, the difference between the fourth embodiment and the first embodiment above is that the first elastic contact arm 321 includes a first raised portion 3211 formed by bending, and the first raised portion 3211 is connected to the front end of the LED chip 2 The shape and structure of the elastic contact arm 331 in the ground terminal 3 are the same as the shape and structure of the first elastic contact arm 321 . That is to say, the first elastic contact arm 321 and the elastic guide arm 331 are respectively in contact with the two ends of the front end of the LED chip 2, and the rear end of the LED chip 2 is in contact with the end of the extension seat 312, so that the first elastic contact arm 321 and the elastic connecting arm 331 can respectively form a stable elastic contact with the positive and negative electrodes 21 and 22 on the front surface of the LED chip 2, and form a non-welding conduction.

[0087] Except for the abo...

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Abstract

The invention discloses an LED chip assembly structure and assembly method of a smart label connector. The LED chip assembly structure of the smart label connector comprises an LED chip, which is arranged in a plastic base in the smart label connector; and a positive electrode and a negative electrode in the LED chip are in elastic pressing contact with a terminal assembly in the smart label connector respectively and form weldless electrical conduction. The LED chip assembly structure is electrically connected with terminals of the smart label connector in an elastic pressing contact manner, and can be connected with a power supply terminal and a ground terminal without a wire, so that the complexity and the assembly difficulty of the structure are greatly simplified; the stability and the communication quality of the product structure can also be ensured; assembly is relatively simple and convenient; and the market competitiveness of the LED chip assembly structure is improved.

Description

Technical field: [0001] The invention relates to the technical field of label connector products, in particular to an LED chip assembly structure of a smart label connector and an assembly method thereof. Background technique: [0002] Optical fiber communication is a communication method that uses light waves as a carrier and optical fiber as a transmission medium to transmit information from one place to another. It is called "wired" optical communication. Nowadays, optical fiber has become the main transmission mode in the world communication because of its wide transmission frequency bandwidth, high anti-interference and low signal attenuation, which is far superior to the transmission of cable and microwave communication. In optical fiber communication technology, it is the most common way to realize the connection between optical fibers through optical fiber adapters and optical fiber plugs. [0003] In actual use, a plurality of optical fiber adapters are set in a fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/717H01R13/46H01R13/02H01R13/648H01R4/48H01R43/20
CPCH01R4/4809H01R13/02H01R13/46H01R13/648H01R13/7175H01R43/20
Inventor 李忠国万军李克辉周侗彭雪胡光才
Owner DONGGUAN YUQIU ELECTRONICS CO LTD
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