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Electronic device

A technology for electronic equipment and circuit boards, applied in the electronic field, can solve problems such as high failure rate of electronic equipment components, affect the overall performance of electronic equipment, and small heat dissipation area, reduce the probability of failure, improve heat dissipation efficiency, and expand heat dissipation area Effect

Active Publication Date: 2016-07-20
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present application provides an electronic device to solve the problem that the electronic device in the prior art has a small heat dissipation due to a small heat dissipation area, which affects the overall performance of the electronic device, and also makes the internal components of the electronic device Technical problems with a high failure rate

Method used

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Embodiment 1

[0037] Please refer to figure 1 , Embodiment 1 of the present application provides an electronic device, including:

[0038] A display screen 101, where the surface of the display screen 101 is the first surface of the electronic device;

[0039] circuit board 102;

[0040] The heating element 103 is arranged on the circuit board 102;

[0041] Back shell, an accommodating space for accommodating the circuit board 102 and the heating element 103 is formed between the back shell and the display screen 101, and the surface of the back shell is the second surface of the electronic device. surface;

[0042] The heat dissipation structure 104 is arranged in the area corresponding to the heating element 103 in the accommodating space, and along the first direction from the front first surface to the second surface, the heat dissipation structure 104 includes at least two layers of heat dissipation layer, along the first direction, the heat dissipation area of ​​the heat generated...

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Abstract

The invention discloses an electronic device. Heat generated by heating elements is transmitted and dispersed layer-by-layer with the actual heat radiation areas of the layers being gradually increasing, so that the final heat radiation area of the electronic device is increased, and the heat dissipating capacity is increased accordingly. The integral performance of the electronic device can be prevented from being affected by poor heat radiation performance, and the fault probability of components in the electronic device can be minimized.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electronic device. Background technique [0002] At present, handheld electronic devices such as smartphones and smart tablets have a large amount of heat dissipation, which is mainly distributed in the chip area and camera area. In the prior art, materials such as silicon grease, gel, or heat-conducting foam are pasted on the shield cover after the chip is packaged by using the high heat transfer rate of the heat dissipation material in the direction perpendicular to the backplane of the electronic device, so that the electronic device The heat transfer power in the direction perpendicular to the backplane is about 3W-10W. However, this heat dissipation method can only solve the heat dissipation problem of the small area of ​​the electronic equipment, that is, the problem of point heat dissipation in the Z direction. If you touch it, you will still feel that the chip ar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20472
Inventor 王晓鹏洪传宝
Owner LENOVO (BEIJING) LTD
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