Dendrobium officinale culture medium and preparation method thereof
A cultivation substrate and Dendrobium technology, which is applied in planting substrates, botanical equipment and methods, cultivation, etc., can solve the problems of artificial cultivation of Dendrobium, difficulty in replacement or maintenance, and high cost of seedbeds, so as to promote the growth of habitat and the growth of friendly microorganisms , the effect of improving nutrient availability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0036] A dendrobium cultivation substrate, comprising a base layer, a buffer layer and a substrate layer arranged successively from bottom to top; the thickness of the base layer is 2cm, the thickness of the buffer layer is 3cm, and the thickness of the substrate layer is 2cm;
[0037] According to the ratio of parts by weight, the base layer is 15 parts of dry wheat straw;
[0038] The buffer layer is a mixture of 5 parts of silkworm excrement, 10 parts of leaf humus, 10 parts of pine cones, 10 parts of wax gourd bark, 8 parts of chaff and 1 part of Trichoderma viride;
[0039] The matrix layer is 15 parts of modified biochar, 5 parts of semi-corroded guava branches, 5 parts of semi-corroded citrus branches, 2 parts of semi-corroded pipa tree branches, 3 parts of semi-corroded grapefruit branches, 5 parts of expanded perlite, and 10 parts of pine bark , a mixture of 5 parts of peanut shells, 5 parts of tangerine falling flowers, 10 parts of ceramsite and 2 parts of Trichoderm...
Embodiment 2
[0046] A dendrobium cultivation substrate, comprising a base layer, a buffer layer and a matrix layer arranged successively from bottom to top; the thickness of the base layer is 5cm, the thickness of the buffer layer is 2cm, and the thickness of the matrix layer is 5cm;
[0047] According to the ratio of parts by weight, the base layer is 20 parts of dry wheat straw;
[0048] The buffer layer is a mixture of 10 parts of silkworm excrement, 20 parts of leaf humus, 15 parts of pine cones, 15 parts of wax gourd bark, 15 parts of chaff and 2 parts of Kangning Trichoderma fungus agent;
[0049] The matrix layer is 25 parts of modified biochar, 20 parts of semi-corroded guava branches, 25 parts of semi-corroded citrus branches, 15 parts of expanded perlite, 35 parts of pine bark, 15 parts of peanut shells, 15 parts of tangerine falling flowers, and 20 parts of ceramsite A mixture of 2 parts and 2 parts of Corning Trichoderma agent;
[0050] The method for preparing the dendrobium ...
Embodiment 3
[0056] A dendrobium cultivation substrate, comprising a base layer, a buffer layer and a substrate layer arranged successively from bottom to top; the thickness of the base layer is 4cm, the thickness of the buffer layer is 3cm, and the thickness of the substrate layer is 4cm;
[0057] According to the ratio of parts by weight, the base layer is 15 parts of dry sugarcane leaves;
[0058] The buffer layer is a mixture of 6 parts of silkworm excrement, 12 parts of leaf humus, 12 parts of pine cones, 12 parts of wax gourd bark, 10 parts of chaff and 2 parts of Kangning Trichoderma fungus agent;
[0059] The matrix layer is 18 parts of modified biochar, 18 parts of semi-corroded pipa tree branches and 18 parts of semi-corroded grapefruit branches, 8 parts of expanded perlite, 16 parts of pine bark, 8 parts of peanut shells, 8 parts of tangerine falling flowers, and 12 parts of ceramsite The mixture of 2 parts and 2 parts of Trichoderma viride;
[0060] The method for preparing th...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Wavelength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com