Method for preparing high-color-gamut white-light LED through employing green-light fluorescent powder
A realization method, the technology of red light phosphor, applied in the field of white light LED backlight, can solve the problems of low color gamut value of backlight source, difficult to control particle size, poor color reproduction, etc., achieve simple packaging process, high excitation efficiency, and equipment less demanding effect
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Embodiment 1
[0036] This embodiment provides a method using MASiO 4 :Er 3+ A method for realizing a white light LED with a high color gamut of green phosphor powder, comprising the following steps:
[0037] 1) According to the mass ratio of 3:1, weigh 7.20g of packaging glue A and 2.40g of packaging glue B, and mix them evenly to obtain a mixed packaging glue. The packaging glue A and the packaging glue B are both epoxy Class encapsulation glue, the viscosity of the mixed encapsulation glue is 600mPa·S, and the refractive index is 1.45;
[0038] 2) Weigh the fluorescent powder according to the emission wavelength of the chip: the chip is an ultraviolet chip, and the emission peak is 300nm. According to the mass ratio of 4:1:5, weigh 0.68g of silicate red fluorescence with a peak wavelength of 640nm powder, 0.17g of MASiO with a peak wavelength of 530nm 4 :Er 3+ Green fluorescent powder and 0.85g of nitride blue fluorescent powder with a peak wavelength of 458nm, three kinds of phosphors ...
Embodiment 2
[0042] This embodiment provides a method using MASiO 4 :Er 3+ A method for realizing a white light LED with a high color gamut of green phosphor powder, comprising the following steps:
[0043] 1) According to the mass ratio of 10:1, weigh 5.80g of packaging glue A and 0.58g of packaging glue B, and mix them evenly to obtain a mixed packaging glue. The packaging glue A and the packaging glue B are silicone A type of encapsulation glue, the viscosity of the mixed encapsulation glue is 4200mPa·S, and the refractive index is 1.50;
[0044] 2) Weigh the fluorescent powder according to the emission wavelength of the chip: the chip is an ultraviolet chip, and the emission peak value is 365nm. According to the mass ratio of 10:1:4.5, weigh 4.00g of silicate red fluorescence with a peak wavelength of 626nm powder, 0.40g of MASiO with a peak wavelength of 535nm 4 :Er 3+ Green fluorescent powder and 1.80g of nitride blue fluorescent powder with a peak wavelength of 472nm, three kind...
Embodiment 3
[0048] This embodiment provides a method using MASiO 4 :Er 3+ A method for realizing a white light LED with a high color gamut of green phosphor powder, comprising the following steps:
[0049] 1) Weigh 5.40g of encapsulation glue A and 2.70g of encapsulation glue B according to the mass ratio of 2:1, and mix them evenly to obtain a mixed encapsulation glue. The encapsulation glue A and the encapsulation glue B are epoxy Class encapsulation glue, the viscosity of the mixed encapsulation glue is 4300mPa·S, and the refractive index is 1.43;
[0050] 2) Weigh the fluorescent powder according to the emission wavelength of the chip: the chip is an ultraviolet chip, and the emission peak is 398nm. According to the mass ratio of 1:1:2.5, weigh 4.20g of silicate red fluorescence with a peak wavelength of 600nm powder, 4.20g of MASiO with a peak wavelength of 539nm 4 :Er 3+ Green fluorescent powder and 10.50g of aluminate blue fluorescent powder with a peak wavelength of 480nm, thr...
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