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Determination device for Seebeck coefficient of flexible thin film material

A technology of flexible thin film materials and Seebeck coefficient, applied in the field of material thermoelectric conversion, can solve the problems of inapplicability of flexible self-supporting thin film performance testing, difficulty in meeting the research needs of flexible thermal management materials, etc., and achieve simple structure, low cost, and easy operation Effect

Inactive Publication Date: 2016-06-22
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the Seebeck coefficient testing equipment for bulk materials and deposited films currently on the market is not suitable for performance testing of flexible self-supporting films, so it is difficult to meet the growing research needs of flexible thermal management materials

Method used

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  • Determination device for Seebeck coefficient of flexible thin film material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A device for measuring Seebeck coefficient of a flexible film material, comprising an infrared thermal imager 1, a sample to be tested 2, a heating assembly 3, a vacuum pump 4, a DC power supply 5, a wire 6, a digital source meter 7, an electrode 8, a cooling assembly 9, a vacuum Box 10, infrared window 11, base 12 and support 13, wherein a vacuum box 10 is installed on the base 12, an infrared window 11 is arranged on the top of the vacuum box 10, and a heating device is installed on the base 12 and inside the vacuum box 10. Component 3 and heat dissipation component 9, the heating component 3 and heat dissipation component 9 are used to suspend the sample 2 to be tested, and the vacuum pump 4 connected to the vacuum box 10 is installed on the side of the base 12 to ensure that the sample 2 to be tested is located in the In a vacuum environment, the infrared thermal imager 1 is installed on the base 12 through a bracket 13, and the infrared thermal imager 1 is above the...

Embodiment 2

[0029] Cut a certain area of ​​graphene\polyaniline composite film material prepared by the suction filtration method, (length × width 12cm × 1cm) as the sample to be tested, fix the two ends of the sample on the heating component and the heat dissipation component, use conductive silver paste to reduce Contact resistance. A vacuum pump is used to maintain the internal pressure of the vacuum box at -0.1MPa, and a DC power supply is used to supply DC power to the heating element with a voltage of 6V. An infrared thermal imager is used to measure the temperature at both ends of the sample through the infrared window, and the thermoelectric potential at both ends of the sample is read according to the digital source meter, and the Seebeck coefficient of the sample is calculated to be 47.0 μV / K.

Embodiment 3

[0031] Cut a certain area of ​​graphene\carbon nanotube\PTFE composite film material prepared by the scraping method, (length×width 15cm×1.2cm) as a test sample, fix the two ends of the sample on the heating component and the heat dissipation component, use conductive silver slurry to reduce contact resistance. A vacuum pump is used to maintain the internal pressure of the vacuum box at -0.1MPa, and a DC power supply is used to supply DC power to the heating component with a voltage of 10V. An infrared thermal imager is used to measure the temperature at both ends of the sample through the infrared window, and the thermoelectric potential at both ends of the sample is read according to the digital source meter, and the Seebeck coefficient of the sample is calculated to be 43.5 μV / K.

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Abstract

The invention relates to a determination device for the Seebeck coefficient of a flexible thin film material. The determination device comprises an infrared thermal imager, a sample to be measured, a heating assembly, a vacuum pump, a direct-current power supply, wires, a digital source, electrodes, a thermal dissipation assembly, a vacuum box, an infrared window, a base and a support; the vacuum box is installed on the base, the infrared window is arranged on the top of the vacuum box, the heating assembly and the thermal dissipation assembly are installed on the positions, in the vacuum box, of the base and used for suspending the sample to be measured, the vacuum pump connected with the vacuum box is installed at the side of the base and used for ensuring that the sample to be measured is located in a vacuum environment, the infrared thermal imager is installed on the base through the support and located over the infrared window, the direct-current power supply is connected with the heating assembly and used for supplying power to the heating assembly, and the digital source is connected with the two ends of the sample to be measured through the wires and the electrodes. The determination device is simple in structure, easy and convenient to operate, low in cost and suitable for being easily used and popularized in the industrial field and the scientific research field.

Description

technical field [0001] The invention belongs to the technical field of thermoelectric conversion of materials, in particular to a device for measuring Seebeck coefficient of flexible thin film materials. Background technique [0002] Thermoelectric materials can realize the interconversion of heat and electricity without any environmental pollution, so they have great application potential in energy utilization. The Seebeck coefficient is a key index to evaluate the performance of thermoelectric materials. Measuring the Seebeck coefficient of materials is very important for the research of thermoelectric materials. At present, the relatively mature and commercialized material Seebeck coefficient testing equipment mainly includes the ZEM-3 of ULVAC in Japan, the PSM of QuantumDesign in the United States, the LSR-3 of Linseis in Germany and our MRS-3 from Wuhan Jiayitong Technology Co., Ltd. in China. These kinds of Seebeck coefficient testing equipment are mainly aimed at b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 李耀刚郭洋王宏志张青红侯成义
Owner DONGHUA UNIV
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