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Multi-layer printed circuit boards suitable for layer reduction design

一种多层印刷、电路板的技术，应用在印刷电路、印刷电路、印刷电路零部件等方向，能够解决制程良率降低、成本提高等问题，达到高信号传输特性的效果

Active Publication Date: 2016-06-15
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the current common problem in the industry is that while the thickness of the printed circuit board is reduced, it is necessary to adopt more precise and smaller line width process conditions to meet the specification requirements of the characteristic impedance, which leads to a large yield rate of the overall process. reduced, and the cost is relatively increased

Method used

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  • Multi-layer printed circuit boards suitable for layer reduction design
  • Multi-layer printed circuit boards suitable for layer reduction design
  • Multi-layer printed circuit boards suitable for layer reduction design

Examples

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Embodiment 1

[0050] Example 1 (E1) Use the EM-355 (D) prepreg (E-glass cloth, 1037, resin content 75%) sold by Taiwan Optoelectronics Materials Co., Ltd., and use the existing layer-reducing design of the above-mentioned prepreg as a multi-layer board Fabrication Method An eight-layer circuit board is fabricated. Embodiment 2 (E2) Use the EM-355(D)K prepreg (L-glass cloth, 1037, resin content 75%) sold by Taiwan Optoelectronics Materials Co., Ltd., and use the existing layer-reducing design of the above-mentioned prepreg as a multi-layer The board manufacturing method makes an eight-layer circuit board. Embodiments 3 to 7 (E3-E7) are to mix the components of the low dielectric resin composition of Table 1, Example 3 (A3) evenly to prepare resin composition glue (varnish), and use L-glass cloth (1037) or NE- The glass cloth is impregnated with the glue to make a prepreg (resin content 75%). The above-mentioned prepreg is used to make an eight-layer circuit board with the existing multilay...

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Abstract

A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55 [Omega] in single-ended signaling and between 90 and 110 [Omega] in differential signaling.

Description

technical field [0001] The present invention relates to a multi-layer printed circuit board suitable for layer reduction design, in particular to a multi-layer printed circuit board that still maintains a better process yield of transmission design under the conditions of multiple lamination and thickness reduction or layer reduction. Background technique [0002] The printed circuit board is one of the key components of many electronic devices. Its technology has gradually developed from the traditional single-layer board to the multi-layer board. The multi-layer circuit layer meets the multi-functional circuit design application. In recent years, it has developed to HDI high Density connection board, which realizes the signal transmission function of the interconnection and intercommunication of the circuits of each layer of the multilayer board through through holes and blind holes. However, multi-layer circuit boards will result in a thicker thickness. In order to meet t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0366H05K2201/029H05K1/025H01P3/082H05K1/024H05K1/0298H05K1/0353H05K1/0242H05K1/0245
Inventor 张明鋛余利智林育德
Owner ELITE MATERIAL
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