Copper-and-aluminum combined radiator

Abstract

Provided is a copper-and-aluminum combined radiator. An aluminum substrate is internally provided with a heat-conducting copper column, the other end of which penetrates out of the aluminum substrate. An aluminum radiating fin integrated with the aluminum substrate is arranged above the aluminum substrate and closely combined with the heat-conducting copper column with the heat-conducting copper column as the center. The copper-and-aluminum combined radiator has following beneficial effects: by fully making use of difference between cooper and aluminum in heat conduction performance and cost, combination is optimized; a structure is novel; and good radiating performance is obtained.

Description

technical field [0001] The invention relates to a CPU heat sink, in particular to a heat sink which adopts copper-aluminum combination to dissipate heat. Background technique [0002] Integrated circuits are heavily used in computer components. As we all know, high temperature is the enemy of integrated circuits; high temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components; the heat that causes high temperature does not come from outside the computer, but from inside the computer, or integrated Inside the circuit; the function of the radiator is to absorb the heat and then dissipate it inside or outside the case to ensure that the temperature of the computer components is normal. Most heat sinks absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distant place through various methods, such as the air in the chassis, and then the chassis transfers th...

AI Technical Summary

Problems solved by technology

[0004] Existing CPU radiators are generally made of aluminum or aluminum alloy. Aluminum material has very good thermal conductivity, but compared with copper material, copper has better thermal conductivity, and the thermal conductivity of copper is close to twice that of aluminum. , but when copper is exposed to the air, the copper material is easily oxidized, thereby reducing the thermal conductivity of copper; and for occasions with relatively high heat dissipation requirements, aluminum heat sinks often cannot meet the heat dissipation requirements

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