Interface of optical backboard

A technology of optical backplane and interface, which is applied in the field of optical communication, can solve problems such as complex implementation, and achieve the effects of simple production, small docking loss, and small docking error

Active Publication Date: 2016-06-15
常州光芯集成光学有限公司
View PDF15 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the implementation of this scheme is complicated, and it has high requirements for the design of the spatial optical path and the fabrication and assembly of the reflector.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Interface of optical backboard
  • Interface of optical backboard
  • Interface of optical backboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Such as figure 1 As shown, an optical backplane interface is composed of an array of N multimode optical waveguide chips 1 including a 90° curved optical waveguide 13 , where N≥2. The substrate 12 of each multimode optical waveguide chip is in contact with the upper surface of the adjacent multimode optical waveguide chip (such as figure 1 The adjacent surfaces of the multimode optical waveguide chip 1 and the multimode optical waveguide chip 2, refer to the upper surface 11 of the multimode optical waveguide chip 1) are completely bonded to it by an adhesive 14, and a plurality of multimode optical waveguide chips The bending direction of the inner 90° curved optical waveguide is consistent after bonding. The adhesive is thermosetting adhesive, and the thickness of the adhesive layer is 50um.

[0026] Wherein, the thickness of each multimode optical waveguide chip is equal to the distance between the cores of the optical fiber array minus the thickness of the adhesiv...

Embodiment 2

[0030] An optical backplane interface: including:

[0031] 1. It consists of a 90°bent multimode optical waveguide chip, which can be called a 90°bend waveguide interface. The substrate of each chip and the upper surface of another chip are fully aligned and bonded by UV-curable glue, and then cured by 1wm / cm2 UV light for 5 minutes after bonding. The bending direction of the multimode optical waveguide remains consistent after bonding.

[0032] 2. The array composed of 90°bending multimode optical waveguide chips is optically polished on the waveguide input and output sections, and the polishing angle is 8°. One end of the cross-section is connected to the 200μm core single-port fiber array on the device, and the other end is connected to the single straight waveguide on the optical backplane.

[0033] 3. The thickness of the chip is 400 μm, and the fiber core spacing of the fiber array is 500 μm.

[0034] 4. The bending radius of the 90°bending multimode optical waveguide...

Embodiment 3

[0039] An optical backplane interface, comprising:

[0040] 1. Consisting of 128 90°bent multimode optical waveguide chips, it can be called a 90°bend waveguide interface. The substrate of each chip and the upper surface of another chip are completely aligned and bonded by UV-curable glue, and then cured with heat-curable glue at 200°C for 2 hours after bonding. The bending direction of the multimode optical waveguide remains consistent after bonding.

[0041] 2. The array composed of 90°bending multimode optical waveguide chips is optically polished on the waveguide input and output sections, and the polishing angle is 0°. One end of the section is connected to the 128-port optical fiber array with a 15 μm core on the device, and the other end is connected to the 128-port straight waveguide array on the optical backplane.

[0042] 3. The thickness of the chip is 126.5μm, and the fiber core spacing of the fiber array is 127um.

[0043] 4. The bending radius of the 90°bendin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to an interface of an optical backboard. The interface is a waveguide array interface bent for 90 degree, and is composed of an array which is formed by combining one or N multimode optical waveguide chips with optical waveguide bent for 90 degree, and N is greater than or equivalent to 2. Compared with the prior art, it is ensured that the optical backboard is placed vertically, the multimode optical waveguide array bent for 90 degree realizes effective coupling between the PLC optical backboard and a fiber array, the spacing of the bent multimode optical waveguide array can be accurately controlled via the thickness of a glass substrate, the butt-joint error between the fiber array and the optical backboard is lower, and butt-joint loss is lower. The interface is simple in preparation, requirements for technology is low, and the optical backboard can be plugged with the fiber array conveniently.

Description

technical field [0001] The invention relates to the field of optical communication, in particular to an optical backplane interface. Background technique [0002] With the increasing popularity of optical communication networks and 4G communication technologies, the network transmission rate has entered the era of Gbps from Mbps, and the transmission rate of the backbone network is even about to enter the era of Tbps. However, switches and high-performance parallel computers, which are the core of the network, are still in the era of "copper interconnection" for their internal chip interconnection. Although the processing capabilities of chips such as microprocessors have been greatly improved in recent years, the limit rate of the "copper interconnection" is only 100Gbps. For the terahertz network that can be expected, the "copper interconnection" is bound to become a bottleneck. It is the optical backplane interconnection technology that came into being. [0003] As earl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/125G02B6/38
CPCG02B6/125G02B6/3807
Inventor 王毅强
Owner 常州光芯集成光学有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap