A lamination system and lamination process for lamination of base material and cover film

Abstract

The invention provides a press-fit system for press-fitting a base material and a cover film. The base material and the cover film undergo press-fit by a press-fit device. The base material is a chip-type base material, and the cover film is a roll-type cover film produced by the utilization of a roll-to-roll technology. The press-fit system comprises a grabbing unit, a transmission unit for transmitting the base material, a roll material feeding unit, a roll-in unit, a press-fit device, a roll-out unit and a roll material receiving unit. According to the press-fit system and the press-fit technology, cost and efficiency are both considered. On one hand, expensive production line for realizing full-automatic press-fit of the base material and the cover film by a roll-to-roll technology is not adopted, and the problem of high cost is overcome; and on the other hand, by the roll-to-chip technology, full-automatic press-fit of the chip-type base material and the roll-type cover film is realized, automatic production of the press-fit technology is realized, and production efficiency is raised.

Description

Technical field [0001] The invention belongs to the technical field of circuit board pressing, and relates to a pressing system and a pressing process for pressing a substrate and a cover film. Background technique [0002] In the circuit board manufacturing process of the prior art, two methods are mainly used when pressing the substrate and the cover film: [0003] One is to directly use the "roll-to-roll" lamination process, that is, both the substrate and the cover film are made into a roll by the "roll-to-roll" process, and then the substrate and cover film are processed by the "roll-to-roll" process. Pressing. The advantage of this method is that it can realize the fully automated production of circuit boards with high efficiency. However, because the base material (ie copper clad laminate) is made into a roll by the "roll-to-roll" process, the production cost per roll is high Therefore, the requirements for the yield rate of the substrate are very high. As a result, the equ...

AI Technical Summary

Problems solved by technology

[0003] One is to directly adopt the "roll-to-roll" lamination process, that is, both the base material and the cover film are made into rolls by the "roll-to-roll" process, and then the base material and the cover film are bonded using the "roll-to-roll" process. Pressing, the advantage of this method is that it can realize the fully automatic production of circuit boards, and the efficiency is very high, but because the base material (that is, the copper clad laminate) is made into a roll by the "roll-to-roll" process, the production cost of each roll is relatively high. , so the requirement for the yield rate of the base material is very high, resulting in the use of the "roll-to-roll" process to produce the base material of each production line equipment must have high performance, which undoubtedly makes the use of the "roll-to-roll" process to achieve full circuit board The cost of automated production is quite high, so although it has the advantages of high efficiency, it cannot be promoted on a large scale in the actual production process;

[0004] Another method is to use the "sheet-to-sheet" lamination process to laminate the base material and the cover film, that is, to use a sheet-type substrate and a sheet-type cover film for lamination. The advantage of this method is that Since the base material is a separate piece, the requirement for the yield rate of the base material is not high. Correspondingly, there is no particularly high requirement for the performance of each equipment in the production line of the base material, so the cost of the production line is low, which is also At present, the production process adopted by most domestic manufacturers, but in the lamination process of this process, it is necessary to manually bond the sheet-type substrate and the sheet-type cover film, and then send them into the lamination equipment for lamination. , the production efficiency is greatly reduced, and a lot of labor costs need to be wasted

[0005] At present, there is no process method that can take into account production cost and efficiency to realize the lamination production of circuit boards

Images