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ReBCO high temperature superconducting wire bonding device and bonding method using same

A high-temperature superconducting and superconducting wire technology, applied in superconducting components, superconducting/high-conducting conductors, welding/welding/cutting items, etc., can solve problems such as system instability and refrigerant evaporation loss

Inactive Publication Date: 2016-06-01
K·约恩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Therefore, even if a superconductor with a resistance of "0" is developed, it is meaningless if a high resistance is displayed at the junction, and Joule heat is generated due to the resistance of the junction, and quenching (quenching) (conversion from superconducting to normal conduction) occurs, causing refrigeration agent evaporation loss, and it is impossible to use the continuous current mode. Due to the power loss of the junction, additional external power needs to be supplied, which will eventually make the system unstable.

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  • ReBCO high temperature superconducting wire bonding device and bonding method using same
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  • ReBCO high temperature superconducting wire bonding device and bonding method using same

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Embodiment Construction

[0032] The embodiments described in detail below with reference to the accompanying drawings make the advantages and features of the present invention and the methods for achieving these advantages and features more clear. However, the present invention is not limited to the embodiments disclosed below, and can be implemented in various ways different from each other. This embodiment is only used to make the disclosure of the present invention more complete and contribute to the common technology in the technical field of the present invention. Personnel fully understand the scope of the invention, and the invention is defined according to the scope of protection of the invention. Throughout the specification, the same reference numerals refer to the same structural elements.

[0033] Hereinafter, referring to the drawings, a second-generation ReBCO high-temperature superconducting wire bonding device and a bonding method using the same according to a preferred embodiment of the ...

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Abstract

Disclosed are a second generation ReBCO high temperature superconducting wire bonding device and a bonding method using the same. The apparatus is capable of manufacturing a persistent current mode and a sufficiently long superconducting wire with nearly zero resistance at a bonding portion, compared to prior normal conductive bonding, by subjecting only superconductive layer materials to micro part melting diffusion or solid diffusion pressure welding in a state where the surfaces of ReBCO high temperature superconducting layers are in direct contact with each other, without an intermediate medium such as a solder or filler.

Description

Technical field [0001] The present invention relates to a ReBCO high-temperature superconducting wire bonding device and a bonding method using the same. More specifically, it relates to the following ReBCO high-temperature superconducting wire bonding device and a bonding method using the same. Under vacuum conditions, only partial pressure and heating of the second generation After the superconducting layer of the high-temperature superconducting wire is joined, the superconductivity that disappears during the joining process can be restored by repressing it in an oxygen atmosphere. Background technique [0002] Generally, the thickness of a superconducting wire is 60-90μm, and there are multiple layers of lamination. Among them, the substance flowing into the superconducting superconductor layer is made of ReBCO (ReBa 2 Cu 3 O 7-x , Where Re is a ceramic composite compound composed of RareEarth rare earth elements, 0=x=0.6). The thickness of the ReBCO layer is 1 to 3 μm. As ra...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21F15/02B23K20/20B23K20/26
CPCB23K20/26B23K20/023B23K20/233B23K2101/38B23K2103/50B23K2101/32H10N60/80B21F15/02B23K2103/08H01B12/06H01B13/0016H01B13/008
Inventor 吴荣根李明勋安熙成
Owner K·约恩
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