Wafer-level LED device and preparation method therefor
A LED device, wafer-level technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of low lens aspect ratio, inability to control lens shape, low light efficiency, etc., to improve light efficiency and reduce production. Cost, simple process effect
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[0027] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.
[0028] Please refer to figure 1 , a method for preparing a wafer-level LED device, comprising the following steps:
[0029] S1, providing an LED preform, including a substrate 10 and an LED chip 11 mounted on the substrate 10;
[0030] S2, forming a limiting groove 102 on the substrate 10, the limiting groove 102 surrounds the LED chip 11, and the depth of the limiting groove 102 gradually deepens along a direction away from the LED chip 11;
[0031] S3 , dispensing glue above the LED chip 11 , making the dispen...
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