A kind of packaging method of LED chip lens

Abstract

The invention relates to a packaging method of an LED chip lens. Packaging is carried out by a potting device, wherein the potting device comprises a substrate (1), an LED chip (3) and a lens, wherein the LED chip (3) is arranged on the substrate (1); the lens wraps the outside of the LED chip (3) and comprises a base layer (21) and a stacked layer (22); the base layer (21) wraps the outside of the LED chip (3); the stacked layer (22) covers the outside of the base layer (21); a first annular groove (11) and a second annular groove (12) are formed in the outer edges of the base layer (21) and the stacked layer (22) and on the substrate (1) respectively; the first annular groove (11) is communicated with the second annular groove (12) through a drain groove (13); and a liquid outlet of the drain groove (13) extends outside from the side wall of the substrate (1). According to the packaging method, wafer-level packaging of an LED can be achieved without a mold; the technical operability is high; the process is simple; and the production cost of the LED can also be reduced.

Description

technical field [0001] The invention relates to the technical field of LED potting, in particular to a method for packaging an LED chip lens. Background technique [0002] Due to the advantages of power saving, long life and small size, LED lamps have been increasingly used in lighting, backlighting and other fields, and are expected to replace traditional light sources such as incandescent lamps and fluorescent lamps. The traditional packaging process of LED devices is a device-level process, which has high cost and is difficult to perform high-density packaging. The lenses of the existing LED devices basically adopt an integrated structure of one-time molding. Most of the traditional lens packages use prefabricated lenses or mold molding methods, which are not suitable for wafer-level packaging. [0003] Based on this, people hope to use the moldless dispensing process to package the lens of the wafer-level LED chip. The simplest and intuitive method of moldless dispensin...

AI Technical Summary

Problems solved by technology

However, this method is not suitable for LED devices with integrated lens structure. In order to make it easy to complete through the simple process of dieless dispensing, there is an urgent need for a new structure of LED devices.

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