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A vertical heat treatment device

A heat treatment device, vertical technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as increased equipment cost, high silicon wafer manufacturing cost, damage to thermal insulation barrels, etc., to achieve good concentricity and stability. , The effect of improving the uniformity of film thickness and reducing equipment cost

Active Publication Date: 2018-06-22
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing process, the crystal boat is made of quartz material, which is expensive. With the development of the process, the manufacturing cost of silicon wafers is getting higher and higher. Correspondingly, higher requirements are put forward for the stability of the wafer process.
In the existing vertical furnace equipment, there are no particularly effective measures for fixing the crystal boat and the heat preservation barrel, and the ability to resist equipment vibration or earthquake is not high, and it is easy to cause the crystal boat and heat preservation barrel to shake or even fall when vibrating , resulting in major economic losses such as batch wafer damage
In order to prevent the shaking of the crystal boat and the heat preservation barrel, the two parts of the crystal boat and the heat preservation barrel are often fixed, but the fixing effect is often not ideal, and the existing fixing methods are often aimed at the integral heat preservation barrel. The parts of the assembled heat preservation barrel cannot be fixed. When vibration occurs, the parts of the assembled heat preservation barrel often collide with each other and damage the heat preservation barrel, which eventually causes the wafer boat to fall and damage the wafer.
[0004] As known in the art, when the same vertical furnace equipment is used for processes at different temperatures, the temperature at the furnace mouth of the reaction chamber is also different. Using the same heat preservation bucket will cause a large change in the temperature at the bottom of the reaction chamber, which will affect the silicon Therefore, in the prior art, different equipment or different insulation barrels need to be prepared for different processes, but this method greatly increases the cost of equipment

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Embodiment Construction

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the following will further describe the implementation of the present invention in detail in conjunction with the accompanying drawings. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0031] The above and other technical features and beneficial effects will be described in detail in conjunction with the embodiments and the accompanying drawings to describe the semiconductor device with the metal gate electrode and the manufacturing method thereof proposed by the present ...

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Abstract

The invention discloses a vertical heat treatment device, which comprises a wafer boat, an insulation barrel and a process door, wherein the insulation barrel comprises a base, upright posts, a quartz housing and multiple groups of male tabs. The vertical heat treatment device can effectively fix various components of the wafer boat and the insulation barrel so that various components of the water boat and the insulation barrel have relatively good concentricity and stability in a reaction chamber; simultaneously accurate positioning of the male tabs of the insulation barrel can be ensured; the male tabs of the insulation barrel can be replaced according to different process requirements; the equipment cost is reduced; the compatibility of the insulation barrel is improved; and thevertical heat treatment device has the advantages of being reasonable in structure and convenient to install. Meanwhile, the quantity, the diameters and the intervals of the male tabs of the insulation barrel can be adjusted to adapt to the temperature requirements of different processes, so that the influence on local wafers caused by a temperature change is improved; the uniformity of a temperature field of the reaction chamber is ensured; and the film thickness uniformity of wafer reaction is improved.

Description

technical field [0001] The invention relates to the technical field of heat treatment of semiconductors, and more specifically relates to a vertical heat treatment device. Background technique [0002] In the semiconductor manufacturing process, in order to implement multiple heat treatment processes such as CVD, oxidation, and diffusion on the processed wafers, such as semiconductor wafers, to achieve different process purposes, a device that can simultaneously perform batch heat treatment on multiple wafers is required . see figure 1 , most of the existing batch heat treatment devices have a furnace body 5, a reaction chamber 3, a wafer boat 4, a heat preservation barrel 2, and a process gate 1, which is used to carry a wafer boat (usually more than 100 wafers) 4 is arranged on the heat preservation barrel 2, and the heat preservation barrel 2 is installed on the process door 1, and the lifting system (not shown in the figure) drives the process door 1 to realize the lif...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/673
CPCH01L21/67109H01L21/67313
Inventor 杨帅董金卫
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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