Preparation method of continuous phenolic-foam-filled honeycomb material with fixed height and thickness

Abstract

The invention relates to a preparation method of a continuous phenolic-foam-filled honeycomb material with fixed height and thickness. The preparation method comprises the following steps: (1) preparing a phenolic resin glue liquid uniformly mixing high-performance phenolic resin, a foaming agent, an additive and a curing agent in a weight ratio of 100 to (10-50) to (10-50) to (20-40); (2) gumming: uniformly coating a surface layer of a honeycomb material with the phenolic resin glue liquid by virtue of a gumming device; and (3) curing: sending the honeycomb material coated with the phenolic resin glue liquid into a drying oven, and curing and forming, so as to obtain the phenolic-foam-filled honeycomb material. Compared with the prior art, the honeycomb material prepared by virtue of the preparation method has the advantages that the thermal insulation performance is good, the application range is relatively wide, meanwhile, the continuous production is realized, and the production cost is lowered as much as possible when the quality is guaranteed.

Description

technical field [0001] The invention relates to the field of chemical materials, in particular to a method for preparing a continuous height-fixed thickness phenolic foam-filled honeycomb material. Background technique [0002] Honeycomb structure composite materials have the characteristics of light weight, fire prevention, corrosion resistance, and sound insulation, and are widely used in architectural decoration, furniture, energy, railways, automobiles, ships and other fields. [0003] Chinese patent CN202882155U discloses a phenolic honeycomb heat insulation and sound insulation board. Filling the honeycomb hole with phenolic resin foam filler overcomes the shortcomings of strong brittleness and high cost of the phenolic board, and the paper honeycomb core is densely covered by phenolic foam. The honeycomb core has the disadvantages of being waterproof, moisture-proof, and fire-proof. Chinese patent CN102199308A discloses a manufacturing method of a phenolic foam-fille...

AI Technical Summary

Problems solved by technology

[0003] Chinese patent CN202882155U discloses a phenolic honeycomb heat insulation and sound insulation board. The phenolic resin foaming filler is filled in the honeycomb holes to overcome the shortcomings of phenolic board brittleness and high cost, and the paper honeycomb core is densely covered by phenolic foam. The shortcomings of the honeycomb core are not waterproof, moisture-proof, and fire-proof

There are not many reports on the improvement of the thermal insulation of honeycomb materials, and the thermal insulation of honeycomb materials is generally poor, which greatly limits its application