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Adaptive temperature control chip microsystem

A micro-system and self-adaptive technology, applied in the field of chip heat dissipation, can solve problems such as product thickness restrictions

Active Publication Date: 2016-05-04
NANTONG FUJITSU MICROELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, the thickness of the product is greatly limited

Method used

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Embodiment Construction

[0035] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0036] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0037] figure 1 It is a schematic structural diagram of an adaptive temperature control chip microsystem provided by an embodiment of the present invention.

[0038] Such as figure 1 As shown, in this embodiment, the adaptive temperature control chip microsystem provided by the present invention...

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Abstract

The invention discloses an adaptive temperature control chip microsystem. The adaptive temperature control chip microsystem is constructed by bonding front sides of a main working chip and a micro-electro-mechanical system chip, wherein the main working chip comprises a first group of bonding pads which is arranged on the front side of the main working chip; and the micro-electro-mechanical system chip comprises a second group of bonding pads which is arranged on the front side of the micro-electro-mechanical system chip and corresponds to the first group of bonding pads, and a groove which is formed in the front side of the micro-electro-mechanical system chip and is used for constructing an enclosed liquid flow channel for heat transfer fluid to flow in the front side of the main working chip in order to cool the main working chip. According to the adaptive temperature control chip microsystem, the groove is formed in the front side of the micro-electro-mechanical system chip, and constructs the enclosed liquid flow channel for the heat transfer fluid to flow together with the front side of the main working chip in order to dissipate heat of the microsystem. Furthermore, a temperature sensor is arranged for detecting a temperature, and a control valve is adjusted according to the detected temperature in order to control a flow rate of the heat transfer fluid, so that control of heat dissipation is realized.

Description

technical field [0001] The present application relates to the technical field of chip heat dissipation, in particular to an adaptive temperature control chip microsystem. Background technique [0002] The current chip will generate heat during the working process, and for this part of the heat, if the heat is not effectively dissipated, the temperature of the chip will gradually increase, thereby affecting the use effect and product reliability. [0003] At present, the usual solution is to paste high thermal conductivity materials such as metal sheets on the back of the chip to dissipate heat. For products with high heat dissipation requirements, additional fans need to be added for targeted heat dissipation. In this way, the thickness of the product is greatly limited. Contents of the invention [0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desired to provide an adaptive temperature control chip microsystem with better heat diss...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00
CPCB81B7/0087B81B7/0093
Inventor 丁万春
Owner NANTONG FUJITSU MICROELECTRONICS
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