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Underfill material and method of manufacturing semiconductor device using same

An underfill material, semiconductor technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as narrow mounting edges, achieve wide mounting edges, achieve no-void mounting, and good solder The effect of engagement

Active Publication Date: 2019-10-22
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, the underfill material only fits well with generally defined installation curves, the installation edge ( )narrow

Method used

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  • Underfill material and method of manufacturing semiconductor device using same
  • Underfill material and method of manufacturing semiconductor device using same
  • Underfill material and method of manufacturing semiconductor device using same

Examples

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Embodiment approach

[0071] In addition, this technology can also be applied to TSV (Through Silicon Via) technology that electrically connects a plurality of chip substrates stacked in a sandwich shape by filling metal into small holes provided in a semiconductor chip.

[0072] That is, it can also be applied to a method of manufacturing a semiconductor device in which a plurality of chip substrates having a first surface on which electrodes with solder are formed and a second surface on which a plurality of chip substrates are stacked are formed on the first surface. On the opposite side, a counter electrode opposite to the electrode with solder is formed.

[0073] At this time, the underfill film is mounted on the second surface of the second chip substrate with the underfill film attached to the first surface side of the first chip substrate. Thereafter, by thermocompression-bonding the first surface of the first chip substrate and the second surface of the second chip substrate at a temperatu...

Embodiment

[0075]

[0076] Hereinafter, examples of the present invention will be described. In this example, a pre-feed type underfill film was produced, and the melt viscosity was measured under conditions of a temperature increase rate of 5° C. / min to 50° C. / min. Then, an IC chip having solder-attached electrodes was connected to an IC substrate having electrodes opposed thereto using an underfill film to produce a package, and voids and solder joints were evaluated. In addition, this invention is not limited to these Examples.

[0077] The measurement of the melt viscosity, the preparation of the package, the evaluation of the voids, and the evaluation of the solder joint were performed as follows.

[0078] [Measurement of Melt Viscosity]

[0079] For each underfill film, using a rheometer (ARES manufactured by TA Co., Ltd.), conditions A at 5°C / min and 1 Hz, condition B at 10°C / min and 1 Hz, condition C at 20°C / min and 1 Hz, and 30 Under condition D of °C / min, 1 Hz, condition E...

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Abstract

Provided are an underfill material capable of realizing a wide mounting margin, and a method of manufacturing a semiconductor device using the same. The minimum melting point when measuring the melt viscosity at a heating rate of 5°C / min to 50°C / min using an underfill material (20) containing epoxy resin, acid anhydride, acrylic resin, and organic peroxide The viscosity attainment temperature is not less than 100°C and not more than 150°C, and the minimum melt viscosity is not less than 100 Pa·s and not more than 5000 Pa·s. Since the change in the temperature at which the minimum melt viscosity is measured under different heating temperature conditions is small, even if the temperature profile at the time of thermocompression bonding is not strictly controlled, it is possible to achieve no-gap mounting and good solder joint performance, and it is possible to realize a wide the mounting edge.

Description

technical field [0001] The present invention relates to an underfill material for mounting a semiconductor chip, and a method of manufacturing a semiconductor device using the same. This application claims priority based on Japanese Patent Application No. Japanese Patent Application No. 2013-188683 for which it applied in Japan on September 11, 2013, and takes in this application by referring this application. Background technique [0002] In recent years, in semiconductor chip mounting methods, the use of "pre-applied underfill film (PUF: Pre-applied Underfill Film)" in which an underfill film is pasted on semiconductor IC (Integrated Circuit) electrodes has been studied in order to shorten the process. [0003] A mounting method using this pre-feed type underfill film is performed, for example, as follows (for example, refer to Patent Document 1). [0004] Step A: An underfill film is pasted on a wafer, followed by dicing to obtain semiconductor chips. [0005] Step B: A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L21/56H01L21/60H01L21/683C09J7/25C09J7/40C09J11/06C09J133/04C09J163/08
CPCC09J133/04C09J163/08H01L21/6836H01L2221/68327H01L2221/68377H01L2224/73104H01L2224/83191H01L2224/271H01L23/293H01L21/563H01L24/13H01L24/16H01L24/27H01L24/29H01L24/32H01L24/73H01L24/81H01L24/83H01L24/92H01L24/94H01L25/0657H01L25/50H01L2224/13025H01L2224/13111H01L2224/13147H01L2224/16146H01L2224/16227H01L2224/16238H01L2224/2919H01L2224/29191H01L2224/2929H01L2224/29291H01L2224/29387H01L2224/32145H01L2224/32225H01L2224/81191H01L2224/81204H01L2224/81444H01L2224/81815H01L2224/83204H01L2224/83862H01L2224/92H01L2224/9211H01L2224/9212H01L2224/94H01L2225/06517H01L2224/27003H01L2225/06513C09D133/066C09J133/066C08G59/42C08L63/00C09D163/00H01L2924/01082H01L2924/01083H01L2924/01047H01L2924/01029H01L2924/01051H01L2924/00014H01L2924/00012H01L2924/0665H01L2924/0635H01L2924/05442H01L2924/05341H01L2924/0549H01L2924/0532H01L2924/0102H01L2924/0544H01L2924/01006H01L2924/01012H01L2224/27H01L2224/81H01L2224/83H01L2224/11H01L21/78C08K5/14C08L33/10H01L23/3142
Inventor 斋藤崇之小山太一森山浩伸
Owner DEXERIALS CORP
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